Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961779 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Chi-Hsi Wu, Shin-Puu Jeng | 2024-04-16 |
| 11133237 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Chi-Hsi Wu, Shin-Puu Jeng | 2021-09-28 |
| 11037852 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Chi-Hsi Wu, Shin-Puu Jeng | 2021-06-15 |
| 10629510 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Chi-Hsi Wu, Shin-Puu Jeng | 2020-04-21 |
| 10461009 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Chi-Hsi Wu, Shin-Puu Jeng | 2019-10-29 |
| 10446520 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Wensen Hung, Szu-Po Huang | 2019-10-15 |
| 10332823 | Packaged semiconductor devices | Szu-Po Huang, Shin-Puu Jeng, Wensen Hung | 2019-06-25 |
| 10157813 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Chi-Hsi Wu, Shin-Puu Jeng | 2018-12-18 |
| 10157818 | Methods of cooling packaged semiconductor devices | Szu-Po Huang, Shin-Puu Jeng, Wensen Hung | 2018-12-18 |
| 10062665 | Semiconductor packages with thermal management features for reduced thermal crosstalk | Wensen Hung, Szu-Po Huang, Shin-Puu Jeng | 2018-08-28 |
| 9985001 | 3DIC package and methods of forming the same | Szu-Po Huang, Shin-Puu Jeng, Wensen Hung | 2018-05-29 |
| 9978660 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Chi-Hsi Wu, Shin-Puu Jeng | 2018-05-22 |
| 9941251 | 3DIC packages with heat dissipation structures | Wensen Hung, Szu-Po Huang, Shin-Puu Jeng | 2018-04-10 |
| 9859266 | Method of forming 3D integrated circuit package with panel type lid | Tsung-Ding Wang, Jung Wei Cheng, Chien Ling Hwang, Hsin-Yu Pan, Han-Ping Pu | 2018-01-02 |
| 9780072 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Wensen Hung, Szu-Po Huang | 2017-10-03 |
| 9735082 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Chi-Hsi Wu, Shin-Puu Jeng | 2017-08-15 |
| 9595506 | Packages with thermal management features for reduced thermal crosstalk and methods of forming same | Wensen Hung, Szu-Po Huang, Shin-Puu Jeng | 2017-03-14 |
| 9583415 | Packages with thermal interface material on the sidewalls of stacked dies | Chen-Hua Yu, Wensen Hung, Szu-Po Huang, An-Jhih Su, Hsiang-Fan Lee +2 more | 2017-02-28 |
| 9576938 | 3DIC packages with heat dissipation structures | Wensen Hung, Szu-Po Huang, Shin-Puu Jeng | 2017-02-21 |
| 9502383 | 3D integrated circuit package processing with panel type lid | Tsung-Ding Wang, Han-Ping Pu, Jung Wei Cheng, Chien Ling Hwang, Hsin-Yu Pan | 2016-11-22 |
| 9496249 | 3DIC package and methods of forming the same | Szu-Po Huang, Shin-Puu Jeng, Wensen Hung | 2016-11-15 |
| 9462692 | Test structure and method of testing electrical characteristics of through vias | Shang-Yun Hou, Wei-Cheng Wu, Hsien-Pin Hu, Jung Cheng Ko, Shin-Puu Jeng +1 more | 2016-10-04 |
| 9385095 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Wensen Hung, Szu-Po Huang | 2016-07-05 |
| 9379036 | 3DIC packages with heat dissipation structures | Wensen Hung, Szu-Po Huang, Shin-Puu Jeng | 2016-06-28 |
| 9269694 | Packages with thermal management features for reduced thermal crosstalk and methods of forming same | Wensen Hung, Szu-Po Huang, Shin-Puu Jeng | 2016-02-23 |