Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165990 | Semiconductor device | Kuan-Yu Huang, Sung-Hui Huang, Pai Yuan Li, Shu-Chia Hsu, Hsiang-Fan Lee | 2024-12-10 |
| 11961779 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2024-04-16 |
| 11587886 | Semiconductor device | Kuan-Yu Huang, Sung-Hui Huang, Pai Yuan Li, Shu-Chia Hsu, Hsiang-Fan Lee | 2023-02-21 |
| 11133237 | Package with embedded heat dissipation features | Wensen Hung, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2021-09-28 |
| 11037852 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2021-06-15 |
| 10629510 | Package with embedded heat dissipation features | Wensen Hung, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2020-04-21 |
| 10629545 | Semiconductor device | Kuan-Yu Huang, Sung-Hui Huang, Pai Yuan Li, Shu-Chia Hsu, Hsiang-Fan Lee | 2020-04-21 |
| 10461009 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2019-10-29 |
| 10446520 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Kim Hong Chen, Wensen Hung | 2019-10-15 |
| 10332823 | Packaged semiconductor devices | Kim Hong Chen, Shin-Puu Jeng, Wensen Hung | 2019-06-25 |
| 10157813 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2018-12-18 |
| 10157818 | Methods of cooling packaged semiconductor devices | Kim Hong Chen, Shin-Puu Jeng, Wensen Hung | 2018-12-18 |
| 10062665 | Semiconductor packages with thermal management features for reduced thermal crosstalk | Kim Hong Chen, Wensen Hung, Shin-Puu Jeng | 2018-08-28 |
| 9985001 | 3DIC package and methods of forming the same | Kim Hong Chen, Shin-Puu Jeng, Wensen Hung | 2018-05-29 |
| 9978660 | Package with embedded heat dissipation features | Wensen Hung, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2018-05-22 |
| 9941251 | 3DIC packages with heat dissipation structures | Wensen Hung, Kim Hong Chen, Shin-Puu Jeng | 2018-04-10 |
| 9780072 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Kim Hong Chen, Wensen Hung | 2017-10-03 |
| 9735082 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2017-08-15 |
| 9595506 | Packages with thermal management features for reduced thermal crosstalk and methods of forming same | Kim Hong Chen, Wensen Hung, Shin-Puu Jeng | 2017-03-14 |
| 9583415 | Packages with thermal interface material on the sidewalls of stacked dies | Chen-Hua Yu, Wensen Hung, An-Jhih Su, Hsiang-Fan Lee, Kim Hong Chen +2 more | 2017-02-28 |
| 9576938 | 3DIC packages with heat dissipation structures | Wensen Hung, Kim Hong Chen, Shin-Puu Jeng | 2017-02-21 |
| 9496249 | 3DIC package and methods of forming the same | Kim Hong Chen, Shin-Puu Jeng, Wensen Hung | 2016-11-15 |
| 9385095 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Kim Hong Chen, Wensen Hung | 2016-07-05 |
| 9379036 | 3DIC packages with heat dissipation structures | Wensen Hung, Kim Hong Chen, Shin-Puu Jeng | 2016-06-28 |
| 9269694 | Packages with thermal management features for reduced thermal crosstalk and methods of forming same | Kim Hong Chen, Wensen Hung, Shin-Puu Jeng | 2016-02-23 |