Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9224673 | Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices | Kim Hong Chen, Wensen Hung, Shin-Puu Jeng | 2015-12-29 |
| 9184128 | 3DIC package and methods of forming the same | Wensen Hung, Kim Hong Chen, Shin-Puu Jeng | 2015-11-10 |
| 9082743 | 3DIC packages with heat dissipation structures | Wensen Hung, Kim Hong Chen, Shin-Puu Jeng | 2015-07-14 |
| 9076754 | 3DIC packages with heat sinks attached to heat dissipating rings | Wensen Hung, Kim Hong Chen, Shin-Puu Jeng | 2015-07-07 |
| 8911821 | Method for forming nanometer scale dot-shaped materials | Chun-An Lu, Hong-Ching Lin, Kuo-Chan Chiou | 2014-12-16 |