Issued Patents All Time
Showing 1–25 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387988 | Method of manufacturing semiconductor package having lid structure | Tsung-Shu Lin, Tsung-Yu Chen | 2025-08-12 |
| 12354927 | Semiconductor device | Yih-Ting Shen, Jia-Syuan Li, Tsung-Yu Chen | 2025-07-08 |
| 12272612 | Semiconductor package module and manufacturing methods thereof | Tsung-Yu Chen | 2025-04-08 |
| 12170237 | Semiconductor structure and manufacturing method thereof | Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Tsung-Shu Lin, Chien-Yuan Huang +1 more | 2024-12-17 |
| 12125757 | Semiconductor package with stiffener structure and method forming the same | Yu-Ling Tsai, Chien-Chia Chiu, Tsung-Yu Chen | 2024-10-22 |
| 12094836 | Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof | Hsuan-Ning Shih, Hsien-Pin Hu, Tsung-Shu Lin, Tsung-Yu Chen, Wen-Hsin Wei | 2024-09-17 |
| 12074154 | Package structure | Tsung-Shu Lin, Tsung-Yu Chen | 2024-08-27 |
| 12021006 | Package structure and method and equipment for forming the same | Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2024-06-25 |
| 11961779 | 3DIC packaging with hot spot thermal management features | Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2024-04-16 |
| 11929293 | Semiconductor package with lid structure | Tsung-Shu Lin, Tsung-Yu Chen | 2024-03-12 |
| 11810833 | Package structure and method and equipment for forming the same | Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2023-11-07 |
| 11721602 | Semiconductor package with stiffener structure | Yu-Ling Tsai, Chien-Chia Chiu, Tsung-Yu Chen | 2023-08-08 |
| 11715675 | Semiconductor device and manufacturing method thereof | Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Tsung-Shu Lin, Chien-Yuan Huang +1 more | 2023-08-01 |
| 11594469 | Semiconductor device and method of manufacture | Shih-Chang Ku, Hung-Chi Li, Tsung-Shu Lin, Tsung-Yu Chen | 2023-02-28 |
| 11587845 | Semiconductor structure | Chi-Hsi Wu, Tsung-Shu Lin, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2023-02-21 |
| 11302600 | Semiconductor device and manufacturing method thereof | Ping-Kang Huang, Sao-Ling Chiu, Tsung-Shu Lin, Tsung-Yu Chen, Chien-Yuan Huang +1 more | 2022-04-12 |
| 11282825 | Package structure | Tsung-Shu Lin, Tsung-Yu Chen | 2022-03-22 |
| 11282766 | Package structure | Shih-Chang Ku, Hung-Chi Li | 2022-03-22 |
| 11257690 | 3DIC package comprising perforated foil sheet | — | 2022-02-22 |
| 11133237 | Package with embedded heat dissipation features | Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2021-09-28 |
| 11088048 | Semiconductor structure | Chi-Hsi Wu, Tsung-Shu Lin, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2021-08-10 |
| 11062971 | Package structure and method and equipment for forming the same | Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2021-07-13 |
| 11037852 | 3DIC packaging with hot spot thermal management features | Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2021-06-15 |
| 11018073 | Heat spreading device and method | Tsung-Shu Lin, Hung-Chi Li, Tsung-Yu Chen | 2021-05-25 |
| 11004771 | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Cheng-Chieh Hsieh, Chi-Hsi Wu, Shin-Puu Jeng, Tsung-Yu Chen | 2021-05-11 |