Issued Patents All Time
Showing 26–50 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978373 | Semiconductor device methods of manufacture | Shih-Chang Ku, Hung-Chi Li, Tsung-Shu Lin, Tsung-Yu Chen | 2021-04-13 |
| 10867885 | Heat spreading device and method | Chen-Hua Yu, Ming-Fa Chen, Tsung-Yu Chen | 2020-12-15 |
| 10867884 | Heat spreading device and method | Chen-Hua Yu, Ming-Fa Chen, Tsung-Yu Chen | 2020-12-15 |
| 10685854 | 3DIC package comprising perforated foil sheet | — | 2020-06-16 |
| 10629510 | Package with embedded heat dissipation features | Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2020-04-21 |
| 10515867 | Semiconductor structure and manufacturing method thereof | Chi-Hsi Wu, Tsung-Shu Lin, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2019-12-24 |
| 10510687 | Packaging devices and methods for semiconductor devices | — | 2019-12-17 |
| 10483187 | Heat spreading device and method | Chen-Hua Yu, Ming-Fa Chen, Tsung-Yu Chen | 2019-11-19 |
| 10461009 | 3DIC packaging with hot spot thermal management features | Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2019-10-29 |
| 10461014 | Heat spreading device and method | Tsung-Shu Lin, Hung-Chi Li, Tsung-Yu Chen | 2019-10-29 |
| 10446520 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Kim Hong Chen, Szu-Po Huang | 2019-10-15 |
| 10332823 | Packaged semiconductor devices | Kim Hong Chen, Szu-Po Huang, Shin-Puu Jeng | 2019-06-25 |
| 10269682 | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Cheng-Chieh Hsieh, Chi-Hsi Wu, Shin-Puu Jeng, Tsung-Yu Chen | 2019-04-23 |
| 10163821 | Packaging devices and methods for semiconductor devices | — | 2018-12-25 |
| 10157813 | 3DIC packaging with hot spot thermal management features | Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2018-12-18 |
| 10157818 | Methods of cooling packaged semiconductor devices | Kim Hong Chen, Szu-Po Huang, Shin-Puu Jeng | 2018-12-18 |
| 10153218 | Semiconductor structure and manufacturing method thereof | Tsung-Yu Chen, Hung-Chi Li, Cheng-Chieh Hsieh, Tung-Liang Shao, Chih-Hang Tung | 2018-12-11 |
| 10062665 | Semiconductor packages with thermal management features for reduced thermal crosstalk | Kim Hong Chen, Szu-Po Huang, Shin-Puu Jeng | 2018-08-28 |
| 9985001 | 3DIC package and methods of forming the same | Kim Hong Chen, Szu-Po Huang, Shin-Puu Jeng | 2018-05-29 |
| 9978660 | Package with embedded heat dissipation features | Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2018-05-22 |
| 9941251 | 3DIC packages with heat dissipation structures | Szu-Po Huang, Kim Hong Chen, Shin-Puu Jeng | 2018-04-10 |
| 9891273 | Test structures and testing methods for semiconductor devices | Yung-Hsin Kuo, Po-Shi Yao | 2018-02-13 |
| 9893021 | Packaging devices and methods for semiconductor devices | — | 2018-02-13 |
| 9780072 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Kim Hong Chen, Szu-Po Huang | 2017-10-03 |
| 9735082 | 3DIC packaging with hot spot thermal management features | Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2017-08-15 |