Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10541185 | Semiconductor devices with bump allocation | — | 2020-01-21 |
| 9891273 | Test structures and testing methods for semiconductor devices | Wensen Hung, Po-Shi Yao | 2018-02-13 |
| 9759745 | Probe card | Yuan-Li LIN, Po-Yi Huang | 2017-09-12 |
| 9557370 | Methods of improving bump allocation for semiconductor devices and semiconductor devices with improved bump allocation | — | 2017-01-31 |
| 9417263 | Testing probe head for wafer level testing, and test probe card | Wensen Hung, Po-Shi Yao | 2016-08-16 |
| 9261534 | Shield pin arrangement | Po-Yi Huang | 2016-02-16 |
| 9207261 | High frequency probing structure | Wensen Hung | 2015-12-08 |
| 9134368 | Contactless wafer probing with improved power supply | Po-Yi Huang | 2015-09-15 |
| 8841931 | Probe card wiring structure | Wensen Hung | 2014-09-23 |
| 8832933 | Method of fabricating a semiconductor test probe head | Wensen Hung, Po-Shi Yao | 2014-09-16 |
| 8723538 | Probe head formation methods employing guide plate raising assembly mechanism | Wensen Hung | 2014-05-13 |
| 8643394 | Non-reflow probe card structure | — | 2014-02-04 |
| 8134380 | Test probe structure | — | 2012-03-13 |