Issued Patents All Time
Showing 51–70 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9653374 | 3DIC package comprising perforated foil sheet | — | 2017-05-16 |
| 9595506 | Packages with thermal management features for reduced thermal crosstalk and methods of forming same | Kim Hong Chen, Szu-Po Huang, Shin-Puu Jeng | 2017-03-14 |
| 9583415 | Packages with thermal interface material on the sidewalls of stacked dies | Chen-Hua Yu, Szu-Po Huang, An-Jhih Su, Hsiang-Fan Lee, Kim Hong Chen +2 more | 2017-02-28 |
| 9576938 | 3DIC packages with heat dissipation structures | Szu-Po Huang, Kim Hong Chen, Shin-Puu Jeng | 2017-02-21 |
| 9496249 | 3DIC package and methods of forming the same | Kim Hong Chen, Szu-Po Huang, Shin-Puu Jeng | 2016-11-15 |
| 9417263 | Testing probe head for wafer level testing, and test probe card | Yung-Hsin Kuo, Po-Shi Yao | 2016-08-16 |
| 9385095 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Kim Hong Chen, Szu-Po Huang | 2016-07-05 |
| 9379036 | 3DIC packages with heat dissipation structures | Szu-Po Huang, Kim Hong Chen, Shin-Puu Jeng | 2016-06-28 |
| 9287194 | Packaging devices and methods for semiconductor devices | — | 2016-03-15 |
| 9269694 | Packages with thermal management features for reduced thermal crosstalk and methods of forming same | Kim Hong Chen, Szu-Po Huang, Shin-Puu Jeng | 2016-02-23 |
| 9224673 | Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices | Kim Hong Chen, Szu-Po Huang, Shin-Puu Jeng | 2015-12-29 |
| 9207261 | High frequency probing structure | Yung-Hsin Kuo | 2015-12-08 |
| 9184128 | 3DIC package and methods of forming the same | Szu-Po Huang, Kim Hong Chen, Shin-Puu Jeng | 2015-11-10 |
| 9082743 | 3DIC packages with heat dissipation structures | Szu-Po Huang, Kim Hong Chen, Shin-Puu Jeng | 2015-07-14 |
| 9076754 | 3DIC packages with heat sinks attached to heat dissipating rings | Szu-Po Huang, Kim Hong Chen, Shin-Puu Jeng | 2015-07-07 |
| 8907472 | 3DIC package comprising perforated foil sheet | — | 2014-12-09 |
| 8878560 | High frequency probing structure | Ying-Hsin Kuo | 2014-11-04 |
| 8841931 | Probe card wiring structure | Yung-Hsin Kuo | 2014-09-23 |
| 8832933 | Method of fabricating a semiconductor test probe head | Yung-Hsin Kuo, Po-Shi Yao | 2014-09-16 |
| 8723538 | Probe head formation methods employing guide plate raising assembly mechanism | Yung-Hsin Kuo | 2014-05-13 |