Issued Patents All Time
Showing 1–25 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394684 | Die stacking structure, semiconductor package and formation method of the die stacking structure | Su-Chun Yang, Jih-Churng Twu, Jiung Wu, Chen-Hua Yu | 2025-08-19 |
| 12341081 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang | 2025-06-24 |
| 12293991 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee | 2025-05-06 |
| 12272637 | Integrated fan-out package with 3D magnetic core inductor | Wen-Shiang Liao, Chen-Hua Yu, Chewn-Pu Jou, Feng-Wei Kuo | 2025-04-08 |
| 12218089 | Packaged semiconductor device and method of forming thereof | Chen-Hua Yu, Kuo-Chung Yee | 2025-02-04 |
| 12132074 | Package | Wen-Shiang Liao | 2024-10-29 |
| 12125794 | Semiconductor device and manufacturing method of semiconductor device | Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang, Wen-Lin Shih | 2024-10-22 |
| 12027446 | Method for forming a semiconductor component with a cooling structure | Tung-Liang Shao, Lawrence Chiang Sheu, Chen-Hua Yu, Yi-Li Hsiao | 2024-07-02 |
| 12002761 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang, Wen-Lin Shih | 2024-06-04 |
| 11996383 | Bonded semiconductor devices and methods of forming the same | Chen-Hua Yu, Tung-Liang Shao | 2024-05-28 |
| 11996351 | Packaged semiconductor device including liquid-cooled lid and methods of forming the same | Sheng-Tsung Hsiao, Jen-Yu Wang, Chung-Jung Wu, Tung-Liang Shao | 2024-05-28 |
| 11955405 | Semiconductor package including thermal interface structures and methods of forming the same | Jen-Yu Wang, Chung-Jung Wu, Sheng-Tsung Hsiao, Tung-Liang Shao, Chen-Hua Yu | 2024-04-09 |
| 11955378 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang | 2024-04-09 |
| 11901263 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang | 2024-02-13 |
| 11688685 | Integrated fan-out package with 3D magnetic core inductor | Wen-Shiang Liao, Chen-Hua Yu, Chewn-Pu Jou, Feng-Wei Kuo | 2023-06-27 |
| 11670670 | Manufacturing method of package | Wen-Shiang Liao | 2023-06-06 |
| 11631629 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang | 2023-04-18 |
| 11581281 | Packaged semiconductor device and method of forming thereof | Chen-Hua Yu, Kuo-Chung Yee | 2023-02-14 |
| 11569147 | Method of forming semiconductor package with composite thermal interface material structure | Tung-Liang Shao, Jen-Yu Wang, Chung-Jung Wu, Chen-Hua Yu | 2023-01-31 |
| 11515233 | Semiconductor component with cooling structure | Tung-Liang Shao, Lawrence Chiang Sheu, Chen-Hua Yu, Yi-Li Hsiao | 2022-11-29 |
| 11456256 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang, Wen-Lin Shih | 2022-09-27 |
| 11443981 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang | 2022-09-13 |
| 11410910 | Packaged semiconductor device including liquid-cooled lid and methods of forming the same | Sheng-Tsung Hsiao, Jen-Yu Wang, Chung-Jung Wu, Tung-Liang Shao | 2022-08-09 |
| 11387164 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang | 2022-07-12 |
| 11348889 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Cheng-Chang Wei | 2022-05-31 |