Issued Patents All Time
Showing 1–25 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424730 | Antenna package for signal transmission | Feng-Wei Kuo | 2025-09-23 |
| 12407087 | Semiconductor structures and method of forming the same | — | 2025-09-02 |
| 12381194 | Package having embedded decoupling capacitor and method of forming the same | — | 2025-08-05 |
| 12334625 | Antenna apparatus and method | — | 2025-06-17 |
| 12306436 | Thermally tunable waveguide and photonic integrated circuit component having the same | Feng-Wei Kuo | 2025-05-20 |
| 12288021 | Apparatus and method for generating a parameterized waveguide optical elements | Feng-Wei Kuo | 2025-04-29 |
| 12272637 | Integrated fan-out package with 3D magnetic core inductor | Chih-Hang Tung, Chen-Hua Yu, Chewn-Pu Jou, Feng-Wei Kuo | 2025-04-08 |
| 12255157 | Semiconductor package device with integrated inductor and manufacturing method thereof | Huan-Neng Chen | 2025-03-18 |
| 12206157 | Semiconductor package with antenna and method of forming the same | — | 2025-01-21 |
| 12191265 | Antenna apparatus and method | Feng-Wei Kuo | 2025-01-07 |
| 12170241 | Embedded metal insulator metal structure | Feng-Wei Kuo | 2024-12-17 |
| 12165952 | Interposer directly bonded to bonding pads on a plurality of dies | Chieh-Yen Chen, Chuei-Tang Wang | 2024-12-10 |
| 12164152 | Method of fabricating semiconductor structure | Feng-Wei Kuo | 2024-12-10 |
| 12154846 | 3DIC package with interposer formed by spin on process | — | 2024-11-26 |
| 12132074 | Package | Chih-Hang Tung | 2024-10-29 |
| 12074125 | Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits | Feng-Wei Kuo, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, William Wu Shen | 2024-08-27 |
| 12066662 | Apparatus for optical coupling and system for communication | Feng-Wei Kuo, Robert Bogdan Staszewski, Jianglin Du | 2024-08-20 |
| 12066658 | Integrated optical devices and methods of forming the same | Feng-Wei Kuo | 2024-08-20 |
| 12062629 | Multiband QAM interface for slab waveguide | Huan-Neng Chen, Chewn-Pu Jou, Feng-Wei Kuo, Lan-Chou Cho, Yanghyo Kim | 2024-08-13 |
| 12046544 | Semiconductor package device with integrated inductor and manufacturing method thereof | Ying-Chih Hsu | 2024-07-23 |
| 12027478 | Manufacturing method of semiconductor structure | Feng-Wei Kuo | 2024-07-02 |
| 12002770 | Power management semiconductor package and manufacturing method thereof | Ying-Chih Hsu | 2024-06-04 |
| 11978697 | Package structure | — | 2024-05-07 |
| 11961809 | Antenna apparatus and method | Feng-Wei Kuo | 2024-04-16 |
| 11953730 | Method of fabricating semiconductor structure | Feng-Wei Kuo | 2024-04-09 |