Issued Patents All Time
Showing 51–75 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11428870 | Semiconductor structure and method of fabricating the same | Feng-Wei Kuo | 2022-08-30 |
| 11417594 | 3DIC package integration for high-frequency RF system | — | 2022-08-16 |
| 11380632 | Semiconductor package device with integrated inductor and manufacturing method thereof | Huan-Neng Chen | 2022-07-05 |
| 11362026 | Embedded metal insulator metal structure | Feng-Wei Kuo | 2022-06-14 |
| 11295979 | Semiconductor package device with integrated antenna and manufacturing method thereof | Feng-Wei Kuo, Chih-Hang Tung, Chen-Hua Yu | 2022-04-05 |
| 11119280 | Grating couplers and methods of making same | Feng-Wei Kuo, Lan-Chou Cho, Huan-Neng Chen, Chewn-Pu Jou | 2021-09-14 |
| 11114745 | Antenna package for signal transmission | Feng-Wei Kuo | 2021-09-07 |
| 11062988 | 3D IC decoupling capacitor structure and method for manufacturing the same | Chewn-Pu Jou | 2021-07-13 |
| 11024979 | 3D IC antenna array with laminated high-k dielectric | Feng-Wei Kuo | 2021-06-01 |
| 11018215 | Package and manufacturing method thereof | Chih-Hang Tung | 2021-05-25 |
| 10930603 | Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits | Feng-Wei Kuo, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, William Wu Shen | 2021-02-23 |
| 10923417 | Integrated fan-out package with 3D magnetic core inductor | Chih-Hang Tung, Chen-Hua Yu, Chewn-Pu Jou, Feng-Wei Kuo | 2021-02-16 |
| 10879343 | Semiconductor arrangement and method of making | Huan-Neng Chen | 2020-12-29 |
| 10770414 | Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structure | Huan-Neng Chen | 2020-09-08 |
| 10734279 | Semiconductor package device with integrated antenna and manufacturing method thereof | Feng-Wei Kuo, Chih-Hang Tung, Chen-Hua Yu | 2020-08-04 |
| 10665536 | 3D IC Decoupling capacitor structure and method for manufacturing the same | Chewn-Pu Jou | 2020-05-26 |
| 10665554 | Magnetic structure for transmission lines in a package system | Huan-Neng Chen | 2020-05-26 |
| 10651053 | Embedded metal insulator metal structure | Chewn-Pu Jou | 2020-05-12 |
| 10511075 | Integrated fan-out package including dielectric waveguide | Chewn-Pu Jou | 2019-12-17 |
| 10475732 | 3DIC package integration for high-frequency RF system | — | 2019-11-12 |
| 10468345 | 3D IC decoupling capacitor structure and method for manufacturing the same | Chewn-Pu Jou | 2019-11-05 |
| 10460987 | Semiconductor package device with integrated antenna and manufacturing method thereof | Feng-Wei Kuo, Chih-Hang Tung, Chen-Hua Yu | 2019-10-29 |
| 10411328 | Patch antenna structures and methods | Feng-Wei Kuo | 2019-09-10 |
| 10319690 | Semiconductor structure and manufacturing method thereof | Chewn-Pu Jou, Chih-Hang Tung, Chen-Hua Yu | 2019-06-11 |
| 10297657 | Magnetic core inductors for integrated voltage regulator | — | 2019-05-21 |