Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394684 | Die stacking structure, semiconductor package and formation method of the die stacking structure | Jih-Churng Twu, Jiung Wu, Chih-Hang Tung, Chen-Hua Yu | 2025-08-19 |
| 12125794 | Semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Wen-Lin Shih | 2024-10-22 |
| 12002761 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Wen-Lin Shih | 2024-06-04 |
| 11955378 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao | 2024-04-09 |
| 11456256 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Wen-Lin Shih | 2022-09-27 |
| 11443981 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao | 2022-09-13 |
| 11342302 | Bonding with pre-deoxide process and apparatus for performing the same | Chen-Hua Yu, Ying-Jui Huang, Chih-Hang Tung, Tung-Liang Shao, Ching-Hua Hsieh +2 more | 2022-05-24 |
| 11101195 | Package structure and method for forming the same | Tung-Liang Shao, Wen-Lin Shih, Chih-Hang Tung, Chen-Hua Yu | 2021-08-24 |
| 11056459 | Chip package structure and method for forming the same | Chih-Hang Tung, Tung-Liang Shao, Geng-Ming CHANG, Chen-Hua Yu | 2021-07-06 |
| 10163835 | Solder bump stretching method | Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu | 2018-12-25 |
| 10034390 | Metal post bonding using pre-fabricated metal posts | Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih, Chen-Hua Yu | 2018-07-24 |
| 9978709 | Solder bump stretching method for forming a solder bump joint in a device | Chung-Jung Wu, Hsiao-Yun Chen, Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih +1 more | 2018-05-22 |
| 9893046 | Thinning process using metal-assisted chemical etching | Yi-Li Hsiao, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu | 2018-02-13 |
| 9842817 | Solder bump stretching method and device for performing the same | Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu | 2017-12-12 |
| 9475145 | Solder bump joint in a device including lamellar structures | Chung-Jung Wu, Hsiao-Yun Chen, Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih +1 more | 2016-10-25 |
| 9263407 | Method for manufacturing a plurality of metal posts | Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih, Chen-Hua Yu | 2016-02-16 |