Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394684 | Die stacking structure, semiconductor package and formation method of the die stacking structure | Su-Chun Yang, Jiung Wu, Chih-Hang Tung, Chen-Hua Yu | 2025-08-19 |
| 11804392 | Method of monitoring tool | Hom-Chung Lin, Chi-Ying Chang, Chin-Yun Chen, Yi-Ting Chang, Feng-Yu CHEN | 2023-10-31 |
| 11569062 | Gas delivery system for ion implanter | Hom-Chung Lin, Yi-Ting Chang, Chao-Po Lu, Tsung-Min Lin | 2023-01-31 |
| 11239099 | Tool monitoring device and method of monitoring tool | Hom-Chung Lin, Chi-Ying Chang, Chin-Yun Chen, Yi-Ting Chang, Feng-Yu CHEN | 2022-02-01 |
| 11056365 | Fault detection method in semiconductor fabrication facility | Hom-Chung Lin, Chin-Yun Chen, Tai-Hsiang Lin, Yu-Chi Tsai | 2021-07-06 |
| 10930527 | Method for controlling temperature of furnace in semiconductor fabrication process | Jian-Lun Lo, Feng-Yu CHEN, Yuan-Hsiao Su, Yi-Chi Huang, Yueh-Ting YANG +1 more | 2021-02-23 |
| 10741426 | Method for controlling temperature of furnace in semiconductor fabrication process | Jian-Lun Lo, Feng-Yu CHEN, Yuan-Hsiao Su, Yi-Chi Huang, Yueh-Ting YANG +1 more | 2020-08-11 |
| 6924215 | Method of monitoring high tilt angle of medium current implant | Hung-Ta Huang, Hsueh-Li Sun, Juinn-Jie Chang, Stanley Huang, Tom Tseng | 2005-08-02 |
| 6878578 | Method for forming a high quality chemical oxide on a freshly cleaned silicon surface as a native oxide replacement | Tsung-Chieh Tsai, Roung-Hui Kao, Chia-Chun Cheng | 2005-04-12 |
| 6837774 | Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using | Tien-Chen Hu | 2005-01-04 |
| 6777251 | Metrology for monitoring a rapid thermal annealing process | Ching-Shan Lu, Fu-Su Lee, Wei-Ming You, Yu-Chien Hsiao | 2004-08-17 |
| 6753249 | Multilayer interface in copper CMP for low K dielectric | Ying-Ho Chen, Weng Chang | 2004-06-22 |
| 6722949 | Ventilated platen/polishing pad assembly for chemcial mechanical polishing and method of using | Tien-Chen Hu | 2004-04-20 |
| 6706577 | Formation of dual gate oxide by two-step wet oxidation | Syun-Ming Jang, Chen-Hua Yu | 2004-03-16 |
| 6647998 | Electrostatic charge-free solvent-type dryer for semiconductor wafers | Ming-Dar Guo, Tsung-Chieh Tsai, Sheng-Hsiung Tseng, Wei-Ming You, Yao-Pin Huang +3 more | 2003-11-18 |
| 6642128 | Method for high temperature oxidations to prevent oxide edge peeling | Ching-Shan Lu, Kuo-Bin Huang | 2003-11-04 |
| 6620725 | Reduction of Cu line damage by two-step CMP | Shau-Lin Shue, Ming-Hsing Tsai, Wen-Jye Tsai, Ying-Ho Chen, Tsu Shih +1 more | 2003-09-16 |
| 6589356 | Method for cleaning a silicon-based substrate without NH4OH vapor damage | Juin-Jie Chang, Rong-Hui Kao | 2003-07-08 |
| 6589872 | Use of low-high slurry flow to eliminate copper line damages | Ying-Ho Chen, Tsu Shih, Syun-Ming Jang | 2003-07-08 |
| 6503333 | Method for cleaning semiconductor wafers with ozone-containing solvent | Rong-Hui Kao, Chia-Chun Cheng | 2003-01-07 |
| 6500753 | Method to reduce the damages of copper lines | Syun-Ming Jang, Ying-Ho Chen, Chen-Hua Yu | 2002-12-31 |
| 6500274 | Apparatus and method for wet cleaning wafers without ammonia vapor damage | Ming-Dar Guo, Chia-Chun Cheng | 2002-12-31 |
| 6429118 | Elimination of electrochemical deposition copper line damage for damascene processing | Ying-Ho Chen, Syun-Ming Jang, Tsu Shih | 2002-08-06 |
| 6425191 | Apparatus and method for reducing solvent residue in a solvent-type dryer for semiconductor wafers | Rong-Hui Kao, Ming-Dar Guo, Tsung-Chieh Tsai, Chia-Chun Cheng | 2002-07-30 |
| 6417106 | Underlayer liner for copper damascene in low k dielectric | Ying-Ho Chen, Tsu Shih, Syun-Ming Jang | 2002-07-09 |