Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6620725 | Reduction of Cu line damage by two-step CMP | Shau-Lin Shue, Ming-Hsing Tsai, Ying-Ho Chen, Tsu Shih, Jih-Churng Twu +1 more | 2003-09-16 |
| 6319831 | Gap filling by two-step plating | Ming-Hsing Tsai | 2001-11-20 |
| 6224737 | Method for improvement of gap filling capability of electrochemical deposition of copper | Ming-Hsing Tsai, Shau-Lin Shue, Chen-Hua Yu | 2001-05-01 |
| 6140241 | Multi-step electrochemical copper deposition process with improved filling capability | Shau-Lin Shue, Ming-Hsing Tsai, Chen-Hua Yu | 2000-10-31 |