Issued Patents All Time
Showing 1–25 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7153197 | Method for achieving uniform CU CMP polishing | Sa-Na Lee, Syun-Ming Jang, Chi-Weng Chung | 2006-12-26 |
| 7091126 | Method for copper surface smoothing | Han-Hsin Kuo, Hung-Wen Su, Wen-Chih Chiou, Hsien-Ming Lee | 2006-08-15 |
| 6833323 | Method for forming patterned features at a semiconductor wafer periphery to prevent metal peeling | Chen-Hua Yui | 2004-12-21 |
| 6821896 | Method to eliminate via poison effect | — | 2004-11-23 |
| 6787470 | Sacrificial feature for corrosion prevention during CMP | Chu-Wei Hu, Chen Cheng Chou | 2004-09-07 |
| 6767833 | Method for damascene reworking | Chen-Hua Yu | 2004-07-27 |
| 6736701 | Eliminate broken line damage of copper after CMP | Shau-Lin Shue, Ying-Ho Chen, Wen-Chih Chiou, Syun-Ming Jang | 2004-05-18 |
| 6726535 | Method for preventing localized Cu corrosion during CMP | Kuan-Ku Hung, Chen-Hua Yu | 2004-04-27 |
| 6686284 | Chemical mechanical polisher equipped with chilled retaining ring and method of using | Chi-Wei Chung, Tung-Ching Tseng, Syun-Ming Jang | 2004-02-03 |
| 6682396 | Apparatus and method for linear polishing | Chen-Hua Yu | 2004-01-27 |
| 6638868 | Method for preventing or reducing anodic Cu corrosion during CMP | Kun-Ku Hung, Wen-Hun Tung, Wen-Chin Chiou | 2003-10-28 |
| 6638328 | Bimodal slurry system | Shen-Nan Lee, Syun-Ming Jang | 2003-10-28 |
| 6635211 | Reinforced polishing pad for linear chemical mechanical polishing and method for forming | Wen-Chih Chiou, Ying-Ho Chen, Syun-Ming Jang | 2003-10-21 |
| 6634930 | Method and apparatus for preventing metal corrosion during chemical mechanical polishing | Ying-Ho Chen, Wen-Chih Chiou, Syun-Ming Jang, Chia-Ming Yang | 2003-10-21 |
| 6620034 | Way to remove Cu line damage after Cu CMP | Jih-Churng Jwu, Ying-Ho Chen, Syun-Ming Jang | 2003-09-16 |
| 6620725 | Reduction of Cu line damage by two-step CMP | Shau-Lin Shue, Ming-Hsing Tsai, Wen-Jye Tsai, Ying-Ho Chen, Jih-Churng Twu +1 more | 2003-09-16 |
| 6602780 | Method for protecting sidewalls of etched openings to prevent via poisoning | Yung-Cheng Lu, Lih-Ping Li, Tien-I Bao, Chung-Chi Ko | 2003-08-05 |
| 6599838 | Method for forming metal filled semiconductor features to improve a subsequent metal CMP process | Sung-Ming Jang | 2003-07-29 |
| 6589872 | Use of low-high slurry flow to eliminate copper line damages | Jih-Churng Twu, Ying-Ho Chen, Syun-Ming Jang | 2003-07-08 |
| 6589852 | Method of replicating alignment marks for semiconductor wafer photolithography | Sung-Ming Jang | 2003-07-08 |
| 6544891 | Method to eliminate post-CMP copper flake defect | Ying-Ho Chen, Wen-Chih Chiou, Syun-Ming Jang | 2003-04-08 |
| 6518166 | Liquid phase deposition of a silicon oxide layer for use as a liner on the surface of a dual damascene opening in a low dielectric constant layer | Sheng-Hsiung Chen, Shun-Long Chen, Hungtse Lin, Frank Hsu | 2003-02-11 |
| 6515366 | Reduction of metal corrosion in semiconductor devices | Wen-Chih Chiou | 2003-02-04 |
| 6501186 | Bond pad having variable density via support and method for fabrication | Chen-Hua Yu | 2002-12-31 |
| 6495452 | Method to reduce capacitance for copper interconnect structures | — | 2002-12-17 |