TT

Tung-Ching Tseng

TSMC: 13 patents #2,298 of 12,232Top 20%
Applied Materials: 1 patents #4,780 of 7,310Top 70%
📍 Taipei, CA: #169 of 623 inventorsTop 30%
Overall (All Time): #343,624 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
11532459 Chemical vapor deposition apparatus with cleaning gas flow guiding member Chih-hung Yeh, Tsung-Lin Lee, Yi-Ming Lin, Sheng-chun Yang 2022-12-20
11315810 Apparatus for wafer processing Sung-Po Yang, Feng-Tao Lee, Shih-Fang Chen 2022-04-26
10121698 Method of manufacturing a semiconductor device Hsiang-Huan Lee, Shau-Lin Shue, Kuang-Kuo Koai, Hai-Ching Chen, Wen-Cheng Yang +3 more 2018-11-06
9548241 Semiconductor device metallization systems and methods Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Hai-Ching Chen, Wen-Cheng Yang +3 more 2017-01-17
9318364 Semiconductor device metallization systems and methods Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Hai-Ching Chen, Wen-Cheng Yang +3 more 2016-04-19
7297632 Scratch reduction for chemical mechanical polishing Chuang-Ping Hou, Syun-Ming Jang, Ying-Ho Chen, Chu-Yun Fu 2007-11-20
7109117 Method for chemical mechanical polishing of a shallow trench isolation structure Syun-Ming Jang, Li-Jia Yang, Chuan-Ping Hou 2006-09-19
7016790 In-line hot-wire sensor for slurry monitoring Li-Jia Yang 2006-03-21
6930040 Method of forming a contact on a silicon-on-insulator wafer Chuan-Ping Hou, Syun-Ming Jang, Ying-Ho Chen 2005-08-16
6812069 Method for improving semiconductor process wafer CMP uniformity while avoiding fracture Syun-Ming Jang, Chih-Hsiang Yao 2004-11-02
6686284 Chemical mechanical polisher equipped with chilled retaining ring and method of using Chi-Wei Chung, Tsu Shih, Syun-Ming Jang 2004-02-03
6579150 Dual detection method for end point in chemical mechanical polishing 2003-06-17
6579151 Retaining ring with active edge-profile control by piezoelectric actuator/sensors Sheng-Yung Liu 2003-06-17
6176930 Apparatus and method for controlling a flow of process material to a deposition chamber Keith Kuang-Kuo Koai, James Jin-Long Chen, Mark S. Johnson, John V. Schmitt, Sean Li 2001-01-23