| 11887970 |
Stacked microfeature devices and associated methods |
Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong |
2024-01-30 |
$12,191,000 |
| 11373979 |
Stacked microfeature devices and associated methods |
Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong |
2022-06-28 |
$17,627,000 |
| 10062667 |
Stacked microfeature devices and associated methods |
Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong |
2018-08-28 |
$23,018,000 |
| 9515046 |
Stacked microfeature devices and associated methods |
Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong |
2016-12-06 |
$15,945,000 |
| 9490220 |
Redistribution structures for microfeature workpieces |
— |
2016-11-08 |
$25,211,000 |
| 9447497 |
Processing chamber gas delivery system with hot-swappable ampoule |
Dien-Yeh Wu, David Santi, Hyman Lam |
2016-09-20 |
$12,933,000 |
| 9313902 |
Conductive structures for microfeature devices and methods for fabricating microfeature devices |
— |
2016-04-12 |
$11,086,000 |
| 8946873 |
Redistribution structures for microfeature workpieces |
— |
2015-02-03 |
$8,965,000 |
| 8491967 |
In-situ chamber treatment and deposition process |
Paul F. Ma, Joseph AuBuchon, Mei Chang, Steven H. Kim, Dien-Yeh Wu +2 more |
2013-07-23 |
$9,121,000 |
| 8400780 |
Stacked microfeature devices |
Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong |
2013-03-19 |
$2,327,000 |
| 8222727 |
Conductive structures for microfeature devices and methods for fabricating microfeature devices |
— |
2012-07-17 |
$3,261,000 |
| 7923824 |
Microelectronic component assemblies and microelectronic component lead frame structures |
— |
2011-04-12 |
$3,744,000 |
| 7742313 |
Stacked microfeature devices |
Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong |
2010-06-22 |
$4,812,000 |
| 7655508 |
Overmolding encapsulation process and encapsulated article made therefrom |
Todd O. Bolken |
2010-02-02 |
$3,689,000 |
| 7652365 |
Microelectronic component assemblies and microelectronic component lead frame structures |
— |
2010-01-26 |
$11,497,000 |
| 7632747 |
Conductive structures for microfeature devices and methods for fabricating microfeature devices |
— |
2009-12-15 |
$5,540,000 |
| 7608788 |
Plating buss and a method of use thereof |
— |
2009-10-27 |
$5,503,000 |
| 7439450 |
Plating buss and a method of use thereof |
— |
2008-10-21 |
$1,313,000 |
| 7296346 |
Plating buss and a method of use thereof |
— |
2007-11-20 |
$1,959,000 |
| 7298025 |
Microelectronic component assemblies and microelectronic component lead frame structures |
— |
2007-11-20 |
$1,959,000 |
| 7247520 |
Microelectronic component assemblies and microelectronic component lead frame structures |
— |
2007-07-24 |
$2,591,000 |
| 7181837 |
Plating buss and a method of use thereof |
— |
2007-02-27 |
$1,963,000 |
| 7151013 |
Semiconductor package having exposed heat dissipating surface and method of fabrication |
David J. Corisis, Mike Brooks, Larry D. Kinsman |
2006-12-19 |
$2,309,000 |
| 7148974 |
Method for tracking the location of mobile agents using stand-off detection technique |
Randal L. Schmitt, Susan Fae Ann Bender, Philip J. Rodacy, Philip J. Hargis, Jr. |
2006-12-12 |
$12,020,000 |
| 7132734 |
Microelectronic component assemblies and microelectronic component lead frame structures |
— |
2006-11-07 |
$2,394,000 |
