Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic component assemblies and microelectronic component lead frame structures

Microelectronic component assemblies and microelectronic component lead frame structures

US Patent 7923824 · Granted Apr 12, 2011

Estimated economic value: $3,744,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stacked microfeature devices and associated methods2024
Stacked microfeature devices and associated methods2022
Stacked microfeature devices and associated methods2018
Stacked microfeature devices and associated methods2016
Redistribution structures for microfeature workpieces2016
Processing chamber gas delivery system with hot-swappable ampoule2016
Conductive structures for microfeature devices and methods for fabricating micro2016
Redistribution structures for microfeature workpieces2015
In-situ chamber treatment and deposition process2013
Stacked microfeature devices2013
Conductive structures for microfeature devices and methods for fabricating micro2012
Stacked microfeature devices2010