Issued Patents All Time
Showing 25 most recent of 95 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456286 | Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods | Chan H. Yoo | 2022-09-27 |
| 10615154 | Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods | Chan H. Yoo | 2020-04-07 |
| 9978730 | Method of assembly semiconductor device with through-package interconnect | Chan H. Yoo | 2018-05-22 |
| 9559087 | Techniques for packaging multiple device components | Chad A. Cobbley | 2017-01-31 |
| 9508686 | Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods | Chan H. Yoo | 2016-11-29 |
| 8906743 | Semiconductor device with molded casing and package interconnect extending therethrough, and associated systems, devices, and methods | Chan H. Yoo | 2014-12-09 |
| 8709878 | Methods of packaging imager devices and optics modules, and resulting assemblies | Scott Willmorth, Bradley R. Bitz | 2014-04-29 |
| 8629558 | Techniques for packaging multiple device components | Chad A. Cobbley | 2014-01-14 |
| 8624371 | Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor | Chad A. Cobbley | 2014-01-07 |
| 8508034 | Electronic devices | Cary J. Baerlocher, Steven W. Heppler, Chad A. Cobbley | 2013-08-13 |
| 8426954 | Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor | Chad A. Cobbley | 2013-04-23 |
| 8212348 | Techniques for packaging multiple device components | Chad A. Cobbley | 2012-07-03 |
| 8115296 | Electronic device package | Cary J. Baerlocher, Steven W. Heppler, Chad A. Cobbley | 2012-02-14 |
| 8110884 | Methods of packaging imager devices and optics modules, and resulting assemblies | Scott Willmorth, Bradley R. Bitz | 2012-02-07 |
| 8008762 | Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor | Chad A. Cobbley | 2011-08-30 |
| 7804171 | Techniques for packaging a multiple device component | Chad A. Cobbley | 2010-09-28 |
| 7791205 | Interposers for semiconductor die packages with standard ball grill array footprint | — | 2010-09-07 |
| 7781875 | Techniques for packaging multiple device components | Chad A. Cobbley | 2010-08-24 |
| 7655508 | Overmolding encapsulation process and encapsulated article made therefrom | Mark S. Johnson | 2010-02-02 |
| 7642643 | Apparatus for molding a semiconductor die package with enhanced thermal conductivity | Frank Hall | 2010-01-05 |
| 7557454 | Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads | — | 2009-07-07 |
| 7553688 | Methods for packaging image sensitive electronic devices | Chad A. Cobbley | 2009-06-30 |
| 7459773 | Stackable ball grid array | Cary J. Baerlocher, Chad A. Cobbley, David J. Corisis | 2008-12-02 |
| 7419854 | Methods for packaging image sensitive electronic devices | Chad A. Cobbley | 2008-09-02 |
| 7399657 | Ball grid array packages with thermally conductive containers | Chad A. Cobbley | 2008-07-15 |