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Chad A. Cobbley — 123 Patents

Micron: 119 patents #117 of 6,374Top 2%

RRRound Rock Research: 3 patents #66 of 239Top 30%

Boise, ID: #57 of 3,546 inventorsTop 2%

Idaho: #75 of 8,810 inventorsTop 1%

Overall (All Time): #9,462 of 4,157,543Top 1%

123 Patents All Time

Chad A. Cobbley has been granted 123 US patents while listed as an inventor at Micron. The first was granted in 2000 and the most recent in January 2017. Chad A. Cobbley ranks #9,462 of 4,157,543 US inventors in our database (top 0.23%). Patent records list Chad A. Cobbley in Boise, ID, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 123 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9559087	Techniques for packaging multiple device components	Todd O. Bolken	2017-01-31	$12,992,000
8872310	Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication	Jonathon G. Greenwood	2014-10-28	$12,316,000
8716849	Semiconductor device including one or more stiffening elements	Cary J. Baerlocher	2014-05-06	$7,858,000
8629558	Techniques for packaging multiple device components	Todd O. Bolken	2014-01-14	$7,948,000
8624371	Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor	Todd O. Bolken	2014-01-07
8599637	Advanced detection of memory device removal, and methods, devices and connectors	James Cooke, Peter Feeley, Victor Y. Tsai, William H. Radke, Neal A. Galbo	2013-12-03	$5,919,000
8508034	Electronic devices	Todd O. Bolken, Cary J. Baerlocher, Steven W. Heppler	2013-08-13	$4,189,000
8426954	Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor	Todd O. Bolken	2013-04-23
8344514	Semiconductor device structures and electronic devices including same hybrid conductive vias	Jonathon G. Greenwood	2013-01-01
8212348	Techniques for packaging multiple device components	Todd O. Bolken	2012-07-03	$4,934,000
8189420	Advanced detection of memory device removal, and methods, devices and connectors	James Cooke, Peter Feeley, Victor Y. Tsai, William H. Radke, Neal A. Galbo	2012-05-29	$3,655,000
8148803	Molded stiffener for thin substrates	Cary J. Baerlocher	2012-04-03	$5,044,000
8115296	Electronic device package	Todd O. Bolken, Cary J. Baerlocher, Steven W. Heppler	2012-02-14	$4,010,000
8008762	Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor	Todd O. Bolken	2011-08-30
7998305	Electrical interconnect using locally conductive adhesive	Steve W. Heppler	2011-08-16	$3,523,000
7939449	Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends	Jonathon G. Greenwood	2011-05-10	$4,804,000
7829190	Electrical interconnect using locally conductive adhesive	Steve W. Heppler	2010-11-09	$3,205,000
7804171	Techniques for packaging a multiple device component	Todd O. Bolken	2010-09-28	$5,668,000
7781875	Techniques for packaging multiple device components	Todd O. Bolken	2010-08-24	$7,473,000
7755204	Stacked die module including multiple adhesives that cure at different temperatures	Timothy L. Jackson	2010-07-13	$3,221,000
7644853	Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux	Michael B. Ball, Marjorie L. Waddel	2010-01-12	$6,789,000
7635079	System for locating conductive sphere utilizing screen and hopper of solder balls	Michael B. Ball, Marjorie L. Waddel	2009-12-22	$13,803,000
7553688	Methods for packaging image sensitive electronic devices	Todd O. Bolken	2009-06-30	$4,341,000
7476277	Apparatus for improving stencil/screen print quality	Tongbi Jiang, John VanNortwick	2009-01-13	$1,962,000
7459773	Stackable ball grid array	Todd O. Bolken, Cary J. Baerlocher, David J. Corisis	2008-12-02	$734,000