| 9559087 |
Techniques for packaging multiple device components |
Todd O. Bolken |
2017-01-31 |
$12,992,000 |
| 8872310 |
Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication |
Jonathon G. Greenwood |
2014-10-28 |
$12,316,000 |
| 8716849 |
Semiconductor device including one or more stiffening elements |
Cary J. Baerlocher |
2014-05-06 |
$7,858,000 |
| 8629558 |
Techniques for packaging multiple device components |
Todd O. Bolken |
2014-01-14 |
$7,948,000 |
| 8624371 |
Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor |
Todd O. Bolken |
2014-01-07 |
|
| 8599637 |
Advanced detection of memory device removal, and methods, devices and connectors |
James Cooke, Peter Feeley, Victor Y. Tsai, William H. Radke, Neal A. Galbo |
2013-12-03 |
$5,919,000 |
| 8508034 |
Electronic devices |
Todd O. Bolken, Cary J. Baerlocher, Steven W. Heppler |
2013-08-13 |
$4,189,000 |
| 8426954 |
Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor |
Todd O. Bolken |
2013-04-23 |
|
| 8344514 |
Semiconductor device structures and electronic devices including same hybrid conductive vias |
Jonathon G. Greenwood |
2013-01-01 |
|
| 8212348 |
Techniques for packaging multiple device components |
Todd O. Bolken |
2012-07-03 |
$4,934,000 |
| 8189420 |
Advanced detection of memory device removal, and methods, devices and connectors |
James Cooke, Peter Feeley, Victor Y. Tsai, William H. Radke, Neal A. Galbo |
2012-05-29 |
$3,655,000 |
| 8148803 |
Molded stiffener for thin substrates |
Cary J. Baerlocher |
2012-04-03 |
$5,044,000 |
| 8115296 |
Electronic device package |
Todd O. Bolken, Cary J. Baerlocher, Steven W. Heppler |
2012-02-14 |
$4,010,000 |
| 8008762 |
Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor |
Todd O. Bolken |
2011-08-30 |
|
| 7998305 |
Electrical interconnect using locally conductive adhesive |
Steve W. Heppler |
2011-08-16 |
$3,523,000 |
| 7939449 |
Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends |
Jonathon G. Greenwood |
2011-05-10 |
$4,804,000 |
| 7829190 |
Electrical interconnect using locally conductive adhesive |
Steve W. Heppler |
2010-11-09 |
$3,205,000 |
| 7804171 |
Techniques for packaging a multiple device component |
Todd O. Bolken |
2010-09-28 |
$5,668,000 |
| 7781875 |
Techniques for packaging multiple device components |
Todd O. Bolken |
2010-08-24 |
$7,473,000 |
| 7755204 |
Stacked die module including multiple adhesives that cure at different temperatures |
Timothy L. Jackson |
2010-07-13 |
$3,221,000 |
| 7644853 |
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux |
Michael B. Ball, Marjorie L. Waddel |
2010-01-12 |
$6,789,000 |
| 7635079 |
System for locating conductive sphere utilizing screen and hopper of solder balls |
Michael B. Ball, Marjorie L. Waddel |
2009-12-22 |
$13,803,000 |
| 7553688 |
Methods for packaging image sensitive electronic devices |
Todd O. Bolken |
2009-06-30 |
$4,341,000 |
| 7476277 |
Apparatus for improving stencil/screen print quality |
Tongbi Jiang, John VanNortwick |
2009-01-13 |
$1,962,000 |
| 7459773 |
Stackable ball grid array |
Todd O. Bolken, Cary J. Baerlocher, David J. Corisis |
2008-12-02 |
$734,000 |
