Issued Patents All Time
Showing 25 most recent of 123 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559087 | Techniques for packaging multiple device components | Todd O. Bolken | 2017-01-31 |
| 8872310 | Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication | Jonathon G. Greenwood | 2014-10-28 |
| 8716849 | Semiconductor device including one or more stiffening elements | Cary J. Baerlocher | 2014-05-06 |
| 8629558 | Techniques for packaging multiple device components | Todd O. Bolken | 2014-01-14 |
| 8624371 | Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor | Todd O. Bolken | 2014-01-07 |
| 8599637 | Advanced detection of memory device removal, and methods, devices and connectors | James Cooke, Peter Feeley, Victor Y. Tsai, William H. Radke, Neal A. Galbo | 2013-12-03 |
| 8508034 | Electronic devices | Todd O. Bolken, Cary J. Baerlocher, Steven W. Heppler | 2013-08-13 |
| 8426954 | Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor | Todd O. Bolken | 2013-04-23 |
| 8344514 | Semiconductor device structures and electronic devices including same hybrid conductive vias | Jonathon G. Greenwood | 2013-01-01 |
| 8212348 | Techniques for packaging multiple device components | Todd O. Bolken | 2012-07-03 |
| 8189420 | Advanced detection of memory device removal, and methods, devices and connectors | James Cooke, Peter Feeley, Victor Y. Tsai, William H. Radke, Neal A. Galbo | 2012-05-29 |
| 8148803 | Molded stiffener for thin substrates | Cary J. Baerlocher | 2012-04-03 |
| 8115296 | Electronic device package | Todd O. Bolken, Cary J. Baerlocher, Steven W. Heppler | 2012-02-14 |
| 8008762 | Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor | Todd O. Bolken | 2011-08-30 |
| 7998305 | Electrical interconnect using locally conductive adhesive | Steve W. Heppler | 2011-08-16 |
| 7939449 | Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends | Jonathon G. Greenwood | 2011-05-10 |
| 7829190 | Electrical interconnect using locally conductive adhesive | Steve W. Heppler | 2010-11-09 |
| 7804171 | Techniques for packaging a multiple device component | Todd O. Bolken | 2010-09-28 |
| 7781875 | Techniques for packaging multiple device components | Todd O. Bolken | 2010-08-24 |
| 7755204 | Stacked die module including multiple adhesives that cure at different temperatures | Timothy L. Jackson | 2010-07-13 |
| 7644853 | Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux | Michael B. Ball, Marjorie L. Waddel | 2010-01-12 |
| 7635079 | System for locating conductive sphere utilizing screen and hopper of solder balls | Michael B. Ball, Marjorie L. Waddel | 2009-12-22 |
| 7553688 | Methods for packaging image sensitive electronic devices | Todd O. Bolken | 2009-06-30 |
| 7476277 | Apparatus for improving stencil/screen print quality | Tongbi Jiang, John VanNortwick | 2009-01-13 |
| 7459773 | Stackable ball grid array | Todd O. Bolken, Cary J. Baerlocher, David J. Corisis | 2008-12-02 |