Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901494 | Packaged LEDs with phosphor films, and associated systems and methods | — | 2024-02-13 |
| 11081625 | Packaged LEDs with phosphor films, and associated systems and methods | — | 2021-08-03 |
| 9735136 | Method for embedding silicon die into a stacked package | Paul A. Silvestri | 2017-08-15 |
| 8936953 | Light emitting diode thermally enhanced cavity package and method of manufacture | — | 2015-01-20 |
| 8878205 | Light emitting diode wafer-level package with self-aligning features | — | 2014-11-04 |
| 8872310 | Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication | Chad A. Cobbley | 2014-10-28 |
| 8598612 | Light emitting diode thermally enhanced cavity package and method of manufacture | — | 2013-12-03 |
| 8441020 | Light emitting diode wafer-level package with self-aligning features | — | 2013-05-14 |
| 8344514 | Semiconductor device structures and electronic devices including same hybrid conductive vias | Chad A. Cobbley | 2013-01-01 |
| 7939449 | Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends | Chad A. Cobbley | 2011-05-10 |
| 6807218 | Laser module and optical subassembly | Robert Francis Darveaux, Jicheng Yang | 2004-10-19 |
| 6596212 | Method and apparatus for increasing thickness of molded body on semiconductor package | Anthony James LoBianco | 2003-07-22 |
| 6593545 | Laser defined pads for flip chip on leadframe package fabrication method | Frank J. Juskey | 2003-07-15 |
| 6577012 | Laser defined pads for flip chip on leadframe package | Frank J. Juskey | 2003-06-10 |
| 6338985 | Making chip size semiconductor packages | — | 2002-01-15 |
| 5716760 | Method for plating a substrate to eliminate the use of a solder mask | Frank J. Juskey, Douglas W. Hendricks | 1998-02-10 |
| 5679498 | Method for producing high density multi-layer integrated circuit carriers | Douglas W. Hendricks, Frank J. Juskey | 1997-10-21 |
| 5647123 | Method for improving distribution of underfill between a flip chip die and a circuit board | James George Lance, Jr., Robert Kenneth Doot | 1997-07-15 |
| 5625224 | Method and apparatus for an integrated circuit chip carrier having improved mounting pad density | Reed A. George | 1997-04-29 |
| 5598967 | Method and structure for attaching a circuit module to a circuit board | Douglas W. Hendricks, Frank J. Juskey | 1997-02-04 |
| 5444303 | Wire bond pad arrangement having improved pad density | Douglas W. Hendricks, Frank J. Juskey | 1995-08-22 |
| 5431332 | Method and apparatus for solder sphere placement using an air knife | Thomas P. Kirby, Edward Juchniewicz, Ovidiu Neiconi | 1995-07-11 |