Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5759910 | Process for fabricating a solder bump for a flip chip integrated circuit | Rick Lee Mangold | 1998-06-02 |
| 5697148 | Flip underfill injection technique | Robert Kenneth Doot, Karl M. Wahlfrid | 1997-12-16 |
| 5647123 | Method for improving distribution of underfill between a flip chip die and a circuit board | Jonathon G. Greenwood, Robert Kenneth Doot | 1997-07-15 |