Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9646857 | Low pressure encapsulant for size-reduced semiconductor package | Howard Terry Glascock, Thomas Scott Morris, Charles E. Carpenter, Robert Hartmann | 2017-05-09 |
| 9269887 | Ultrathin flip-chip packaging techniques and configurations | Robert Hartmann, Thomas Scott Morris, Howard Terry Glascock, Jose F. Ordonez | 2016-02-23 |
| 8680683 | Wafer level package with embedded passive components and method of manufacturing | Robert Hartmann | 2014-03-25 |
| 8487435 | Sheet-molded chip-scale package | Paul D. Bantz, Otto Berger | 2013-07-16 |
| 8030770 | Substrateless package | Dean Monthei | 2011-10-04 |
| 7489021 | Lead frame with included passive devices | Daniel Lau, Lawrence R. Thompson | 2009-02-10 |
| 7247933 | Thin multiple semiconductor die package | Daniel Lau | 2007-07-24 |
| 6593545 | Laser defined pads for flip chip on leadframe package fabrication method | Jonathon G. Greenwood | 2003-07-15 |
| 6577012 | Laser defined pads for flip chip on leadframe package | Jonathon G. Greenwood | 2003-06-10 |
| 6546620 | Flip chip integrated circuit and passive chip component package fabrication method | Christopher M. Scanlan, Pat O'Brien | 2003-04-15 |
| 6534338 | Method for molding semiconductor package having a ceramic substrate | Ronald James Schoonejongen, Anthony James LoBianco | 2003-03-18 |
| 6507102 | Printed circuit board with integral heat sink for semiconductor package | John R. McMillan, Ronald Patrick Huemoeller | 2003-01-14 |
| 6417576 | Method and apparatus for attaching multiple metal components to integrated circuit modules | Ron Ellenberger, Ronald James Schoonejongen | 2002-07-09 |
| 6356453 | Electronic package having flip chip integrated circuit and passive chip component | Christopher M. Scanlan, Pat O'Brien | 2002-03-12 |
| 6340846 | Making semiconductor packages with stacked dies and reinforced wire bonds | Anthony James LoBianco, Stephen G. Shermer, Vincent DiCaprio, Thomas P. Glenn | 2002-01-22 |
| 6337228 | Low-cost printed circuit board with integral heat sink for semiconductor package | John R. McMillan, Ronald Patrick Huemoeller | 2002-01-08 |
| 6137690 | Electronic assembly | Robert T. Carson, Arnold W. Hogrefe | 2000-10-24 |
| 6069679 | Selective call receiver having a display module with integrated circuits and method therefor | Scott L. Joslin, Douglas W. Hendricks | 2000-05-30 |
| 5918363 | Method for marking functional integrated circuit chips with underfill material | Reed A. George, Richard Lee Mangold | 1999-07-06 |
| 5800723 | Process for fabricating flex circuits and product thereby | Douglas W. Hendricks, Sally A. Stallings | 1998-09-01 |
| 5716760 | Method for plating a substrate to eliminate the use of a solder mask | Jonathon G. Greenwood, Douglas W. Hendricks | 1998-02-10 |
| 5679498 | Method for producing high density multi-layer integrated circuit carriers | Jonathon G. Greenwood, Douglas W. Hendricks | 1997-10-21 |
| 5598967 | Method and structure for attaching a circuit module to a circuit board | Jonathon G. Greenwood, Douglas W. Hendricks | 1997-02-04 |
| 5542171 | Method of selectively releasing plastic molding material from a surface | Anthony B. Suppelsa, Fadia Nounou | 1996-08-06 |
| 5535101 | Leadless integrated circuit package | Barry M. Miles, Kingshuk Banerji | 1996-07-09 |