Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5623127 | Single alloy solder clad substrate | Edwin L. Bradley, III, William B. Mullen, III | 1997-04-22 |
| 5573602 | Solder paste | Edwin L. Bradley, III | 1996-11-12 |
| 5540379 | Soldering process | Vahid Kazem-Goudarzi, Henry F. Liebman, William B. Mullen, III, Edwin L. Bradley, III | 1996-07-30 |
| 5535101 | Leadless integrated circuit package | Barry M. Miles, Frank J. Juskey | 1996-07-09 |
| 5499756 | Method of applying a tacking agent to a printed circuit board | Edwin L. Bradley, III, Francisco da Costa Alves | 1996-03-19 |
| 5446625 | Chip carrier having copper pattern plated with gold on one surface and devoid of gold on another surface | Glenn F. Urbish, William B. Mullen, III | 1995-08-29 |
| 5429293 | Soldering process | Edwin L. Bradley, III, Vahid Kazem-Goudarzi | 1995-07-04 |
| 5427865 | Multiple alloy solder preform | William B. Mullen, III, Edwin L. Bradley, III, Vahid Kazem-Goudarzi | 1995-06-27 |
| 5415944 | Solder clad substrate | Vahid Kazem-Goudarzi, Edwin L. Bradley, III, Henry F. Liebman | 1995-05-16 |
| 5311059 | Backplane grounding for flip-chip integrated circuit | Fadia Nounou, William B. Mullen, III | 1994-05-10 |
| 5293067 | Integrated circuit chip carrier | Kenneth R. Thompson, William B. Mullen, III | 1994-03-08 |
| 5262674 | Chip carrier for an integrated circuit assembly | Kenneth R. Thompson, Francisco Alves | 1993-11-16 |
| 5203076 | Vacuum infiltration of underfill material for flip-chip devices | Francisco Alves, Robert Francis Darveaux | 1993-04-20 |
| 5166774 | Selectively releasing conductive runner and substrate assembly having non-planar areas | Anthony B. Suppelsa, William B. Mullen, III. | 1992-11-24 |
| 5152451 | Controlled solder oxidation process | Robert Francis Darveaux, Francisco da Costa Alves | 1992-10-06 |