Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6307304 | Switch system | Rudy Yorio, Andrzej T. Guzik, Danny E. Ross, Raymond C. Vivian, Jr. | 2001-10-23 |
| 6242802 | Moisture enhanced ball grid array package | Barry M. Miles, Glenn E. Gold | 2001-06-05 |
| 6104119 | Piezoelectric switch | Andrzej T. Guzik, Rudy Yorio, Adolph C. Naujoks | 2000-08-15 |
| 6060817 | Switching method using a frequency domain piezoelectric switch | Andrzej T. Guzik, Rudy Yorio, Adolph C. Naujoks | 2000-05-09 |
| 5977690 | Piezoelectric switch apparatus for a communication device | David L. Ellis, Andrzej T. Guzik, Rudy Yorio, Steven D. Pratt, Sivakumar Muthuswamy | 1999-11-02 |
| 5774341 | Solderless electrical interconnection including metallized hook and loop fasteners | Glenn F. Urbish, Robert W. Pennisi, Dale W. Dorinski | 1998-06-30 |
| 5761093 | Quality forecasting engine | Glenn F. Urbish, Scott G. Potter | 1998-06-02 |
| 5734343 | One-way optical highway communication system | Glenn F. Urbish, Robert W. Pennisi, Dale W. Dorinski | 1998-03-31 |
| 5694296 | Multipoint electrical interconnection having deformable J-hooks | Glenn F. Urbish, Robert W. Pennisi, Robert W. Shisler, Richard A. Ceraldi | 1997-12-02 |
| 5623127 | Single alloy solder clad substrate | Edwin L. Bradley, III, Kingshuk Banerji | 1997-04-22 |
| 5540379 | Soldering process | Vahid Kazem-Goudarzi, Henry F. Liebman, Kingshuk Banerji, Edwin L. Bradley, III | 1996-07-30 |
| 5446625 | Chip carrier having copper pattern plated with gold on one surface and devoid of gold on another surface | Glenn F. Urbish, Kingshuk Banerji | 1995-08-29 |
| 5435481 | Soldering process | Francisco da Costa Alves, John M. Nickelsen, Jr. | 1995-07-25 |
| 5427865 | Multiple alloy solder preform | Kingshuk Banerji, Edwin L. Bradley, III, Vahid Kazem-Goudarzi | 1995-06-27 |
| 5338391 | Method of making a substrate having selectively releasing conductive runners | Anthony B. Suppelsa, Glenn F. Urbish | 1994-08-16 |
| 5311059 | Backplane grounding for flip-chip integrated circuit | Kingshuk Banerji, Fadia Nounou | 1994-05-10 |
| 5293067 | Integrated circuit chip carrier | Kenneth R. Thompson, Kingshuk Banerji | 1994-03-08 |
| 5280139 | Selectively releasing conductive runner and substrate assembly | Anthony B. Suppelsa, Glenn F. Urbish | 1994-01-18 |
| 5241133 | Leadless pad array chip carrier | Glenn F. Urbish, Bruce J. Freyman | 1993-08-31 |
| 5184768 | Solder interconnection verification | Robert Hall, Glenn F. Urbish | 1993-02-09 |
| 5177134 | Tacking agent | Anthony B. Suppelsa, Robert W. Pennisi | 1993-01-05 |
| 5024372 | Method of making high density solder bumps and a substrate socket for high density solder bumps | Leonard F. Altman, Jill L. Flaugher, Anthony B. Suppelsa | 1991-06-18 |
| 4889275 | Method for effecting solder interconnects | Douglas W. Hendricks | 1989-12-26 |
| 4878851 | Electrical socket apparatus with temporary housing | — | 1989-11-07 |
| 4877569 | Method of making a one-piece injection molded battery contact assembly | Glenn F. Urbish, Charles W. Mooney | 1989-10-31 |