DH

Douglas W. Hendricks

Motorola: 15 patents #501 of 12,470Top 5%
Overall (All Time): #328,225 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6069679 Selective call receiver having a display module with integrated circuits and method therefor Scott L. Joslin, Frank J. Juskey 2000-05-30
5800723 Process for fabricating flex circuits and product thereby Frank J. Juskey, Sally A. Stallings 1998-09-01
5716760 Method for plating a substrate to eliminate the use of a solder mask Frank J. Juskey, Jonathon G. Greenwood 1998-02-10
5679498 Method for producing high density multi-layer integrated circuit carriers Jonathon G. Greenwood, Frank J. Juskey 1997-10-21
5598967 Method and structure for attaching a circuit module to a circuit board Jonathon G. Greenwood, Frank J. Juskey 1997-02-04
5452656 Apparatus for selectively applying solder paste to multiple types of printed circuit boards Christopher Lee Becher, Richard Lee Mangold 1995-09-26
5444303 Wire bond pad arrangement having improved pad density Jonathon G. Greenwood, Frank J. Juskey 1995-08-22
5439162 Direct chip attachment structure and method Reed A. George, John P. Cheraso 1995-08-08
5436028 Method and apparatus for selectively applying solder paste to multiple types of printed circuit boards Christopher Lee Becher, Richard Lee Mangold 1995-07-25
5336931 Anchoring method for flow formed integrated circuit covers Frank J. Juskey 1994-08-09
5323947 Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement Frank J. Juskey, Kenneth M. Wasko 1994-06-28
5296046 Subliming solder flux composition Frank J. Juskey 1994-03-22
5164022 Method and apparatus for applying solder flux Jerrold Scott Pine, Stefan Peana 1992-11-17
5001038 Process for photoimaging a three dimensional printed circuit substrate Dale W. Dorinski, M. William Branan, Jr., Glenn F. Urbish, Anthony B. Suppelsa, Martin J. McKinley 1991-03-19
4889275 Method for effecting solder interconnects William B. Mullen, III 1989-12-26