Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5918363 | Method for marking functional integrated circuit chips with underfill material | Frank J. Juskey, Richard Lee Mangold | 1999-07-06 |
| 5829668 | Method for forming solder bumps on bond pads | Dennis Brian Miller | 1998-11-03 |
| 5625224 | Method and apparatus for an integrated circuit chip carrier having improved mounting pad density | Jonathon G. Greenwood | 1997-04-29 |
| 5475379 | Solid phase conformal coating suitable for use with electronic devices | Richard Lee Mangold, Richard K. Brooks | 1995-12-12 |
| 5439162 | Direct chip attachment structure and method | John P. Cheraso, Douglas W. Hendricks | 1995-08-08 |
| 5386624 | Method for underencapsulating components on circuit supporting substrates | Richard Lee Mangold, Richard K. Brooks | 1995-02-07 |