Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9367712 | High density memory card using folded flex | Lee Smith, Jeffrey Alan Miks, Curtis Zwenger | 2016-06-14 |
| 6242802 | Moisture enhanced ball grid array package | William B. Mullen, III, Glenn E. Gold | 2001-06-05 |
| 6201305 | Making solder ball mounting pads on substrates | Robert Francis Darveaux, Alexander William Copia | 2001-03-13 |
| 5831832 | Molded plastic ball grid array package | Joseph G. Gillette, Sivakumar Muthuswamy | 1998-11-03 |
| 5721450 | Moisture relief for chip carriers | — | 1998-02-24 |
| 5696666 | Low profile exposed die chip carrier package | Glenn E. Gold | 1997-12-09 |
| 5535101 | Leadless integrated circuit package | Frank J. Juskey, Kingshuk Banerji | 1996-07-09 |
| 5515188 | Method of manufacturing a liquid crystal display device in which a vacuum reservoir attached to the LCD is placed in a conformable container or bag | Robert B. Akins | 1996-05-07 |
| 5296738 | Moisture relief for chip carrier | Bruce J. Freyman, Frank J. Juskey | 1994-03-22 |
| 5198264 | Method for adhering polyimide to a substrate | Leonard F. Altman, Jill L. Flaugher | 1993-03-30 |
| 5166772 | Transfer molded semiconductor device package with integral shield | Keith D. Soldner, Frank J. Juskey, Bruce J. Freyman | 1992-11-24 |
| 5153385 | Transfer molded semiconductor package with improved adhesion | Frank J. Juskey, Lonnie L. Bernardoni, Thomas J. Swirbel | 1992-10-06 |
| 5134462 | Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate | Bruce J. Freyman, Jill L. Flaugher | 1992-07-28 |
| 5077633 | Grounding an ultra high density pad array chip carrier | Bruce J. Freyman, Frank J. Juskey | 1991-12-31 |
| 5031027 | Shielded electrical circuit | Dale W. Dorinski, David E. Reiff | 1991-07-09 |
| 5019673 | Flip-chip package for integrated circuits | Frank J. Juskey, Marc Papageorge | 1991-05-28 |
| 5006673 | Fabrication of pad array carriers from a universal interconnect structure | Bruce J. Freyman, Jill L. Flaugher | 1991-04-09 |
| 4940181 | Pad grid array for receiving a solder bumped chip carrier | Frank J. Juskey, Anthony B. Suppelsa | 1990-07-10 |