Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5457610 | Low profile mechanical interconnect system having metalized loop and hoop area | Thomas J. Swirbel | 1995-10-10 |
| 5369880 | Method for forming solder deposit on a substrate | Ved V. Gundotra, Edward Joseph Hall | 1994-12-06 |
| 5278726 | Method and apparatus for partially overmolded integrated circuit package | Thomas J. Swirbel, John K. Arledge | 1994-01-11 |
| 5218759 | Method of making a transfer molded semiconductor device | Frank J. Juskey, Bruce J. Freyman, Anthony B. Suppelsa | 1993-06-15 |
| 5172852 | Soldering method | Kenneth R. Thompson, Anthony B. Suppelsa | 1992-12-22 |
| 5172303 | Electronic component assembly | James A. Zollo, Kenneth R. Thompson | 1992-12-15 |
| 5153385 | Transfer molded semiconductor package with improved adhesion | Frank J. Juskey, Thomas J. Swirbel, Barry M. Miles | 1992-10-06 |
| 5153379 | Shielded low-profile electronic component assembly | Andrzej T. Guzuk, Todd W. Roshitsh, Scott M. Engstrom | 1992-10-06 |