Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201066 | Control of under-fill using a dam on a packaging substrate for a dual-sided ball grid array package | Robert Francis Darveaux, Yi-Ling Liu | 2021-12-14 |
| 6329606 | Grid array assembly of circuit boards with singulation grooves | John Briar, Jack C. Maxcy | 2001-12-11 |
| 6124637 | Carrier strip and molded flex circuit ball grid array and method of making | Robert Francis Darveaux | 2000-09-26 |
| 5985695 | Method of making a molded flex circuit ball grid array | Robert Francis Darveaux | 1999-11-16 |
| 5859475 | Carrier strip and molded flex circuit ball grid array | Robert Francis Darveaux | 1999-01-12 |
| 5852870 | Method of making grid array assembly | John Briar, Jack C. Maxcy | 1998-12-29 |
| 5635671 | Mold runner removal from a substrate-based packaged electronic device | John Briar, Young Wook Heo, Il Kwon Shim | 1997-06-03 |
| 5438224 | Integrated circuit package having a face-to-face IC chip arrangement | Marc Papageorge, Frank J. Juskey, John R. Thome | 1995-08-01 |
| 5296738 | Moisture relief for chip carrier | Frank J. Juskey, Barry M. Miles | 1994-03-22 |
| 5241133 | Leadless pad array chip carrier | William B. Mullen, III, Glenn F. Urbish | 1993-08-31 |
| 5218759 | Method of making a transfer molded semiconductor device | Frank J. Juskey, Lonnie L. Bernardoni, Anthony B. Suppelsa | 1993-06-15 |
| 5166772 | Transfer molded semiconductor device package with integral shield | Keith D. Soldner, Frank J. Juskey, Barry M. Miles | 1992-11-24 |
| 5136366 | Overmolded semiconductor package with anchoring means | Nicolaas H. Worp, Kurt C. Conrath | 1992-08-04 |
| 5134462 | Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate | Barry M. Miles, Jill L. Flaugher | 1992-07-28 |
| 5077633 | Grounding an ultra high density pad array chip carrier | Barry M. Miles, Frank J. Juskey | 1991-12-31 |
| 5006673 | Fabrication of pad array carriers from a universal interconnect structure | Barry M. Miles, Jill L. Flaugher | 1991-04-09 |
| 4700473 | Method of making an ultra high density pad array chip carrier | Dale W. Dorinski, John D. Shurboff | 1987-10-20 |
| 4700276 | Ultra high density pad array chip carrier | Dale W. Dorinski, John D. Shurboff | 1987-10-13 |