Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7081668 | Flip chip molded/exposed die process and package structure | — | 2006-07-25 |
| 6828671 | Enhanced BGA grounded heatsink | Weddie Aquien, Setho Sing Fee | 2004-12-07 |
| 6770962 | Disposable mold runner gate for substrate based electronic packages | — | 2004-08-03 |
| 6759752 | Single unit automated assembly of flex enhanced ball grid array packages | Raymundo M. Camenforte | 2004-07-06 |
| 6750082 | Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip | Roman Perez, Tan Kim Hwee | 2004-06-15 |
| 6660565 | Flip chip molded/exposed die process and package structure | — | 2003-12-09 |
| 6617525 | Molded stiffener for flexible circuit molding | Raymundo M. Camenforte | 2003-09-09 |
| 6543127 | Coplanarity inspection at the singulation process | Antonio B. Dimaano, Jr., Weddie Aquien | 2003-04-08 |
| 6544812 | Single unit automated assembly of flex enhanced ball grid array packages | Raymundo M. Camenforte | 2003-04-08 |
| 6537857 | Enhanced BGA grounded heatsink | Weddie Aquien, Setho Sing Fee | 2003-03-25 |
| 6479903 | Flip chip thermally enhanced ball grid array | — | 2002-11-12 |
| 6432742 | Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages | Chow Seng Guan, Loreto Cantillep | 2002-08-13 |
| 6372553 | Disposable mold runner gate for substrate based electronic packages | — | 2002-04-16 |
| 6355199 | Method of molding flexible circuit with molded stiffener | Raymundo M. Camenforte | 2002-03-12 |
| 6329606 | Grid array assembly of circuit boards with singulation grooves | Bruce J. Freyman, Jack C. Maxcy | 2001-12-11 |
| 6255143 | Flip chip thermally enhanced ball grid array | — | 2001-07-03 |
| 6168975 | Method of forming extended lead package | Tong Zhang | 2001-01-02 |
| 6103550 | Molded tape support for a molded circuit package prior to dicing | Raymundo M. Camenforte | 2000-08-15 |
| 5852870 | Method of making grid array assembly | Bruce J. Freyman, Jack C. Maxcy | 1998-12-29 |
| 5635671 | Mold runner removal from a substrate-based packaged electronic device | Bruce J. Freyman, Young Wook Heo, Il Kwon Shim | 1997-06-03 |