| 7081668 |
Flip chip molded/exposed die process and package structure |
— |
2006-07-25 |
| 6828671 |
Enhanced BGA grounded heatsink |
Weddie Aquien, Setho Sing Fee |
2004-12-07 |
| 6770962 |
Disposable mold runner gate for substrate based electronic packages |
— |
2004-08-03 |
| 6759752 |
Single unit automated assembly of flex enhanced ball grid array packages |
Raymundo M. Camenforte |
2004-07-06 |
| 6750082 |
Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip |
Roman Perez, Tan Kim Hwee |
2004-06-15 |
| 6660565 |
Flip chip molded/exposed die process and package structure |
— |
2003-12-09 |
| 6617525 |
Molded stiffener for flexible circuit molding |
Raymundo M. Camenforte |
2003-09-09 |
| 6543127 |
Coplanarity inspection at the singulation process |
Antonio B. Dimaano, Jr., Weddie Aquien |
2003-04-08 |
| 6544812 |
Single unit automated assembly of flex enhanced ball grid array packages |
Raymundo M. Camenforte |
2003-04-08 |
| 6537857 |
Enhanced BGA grounded heatsink |
Weddie Aquien, Setho Sing Fee |
2003-03-25 |
| 6479903 |
Flip chip thermally enhanced ball grid array |
— |
2002-11-12 |
| 6432742 |
Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages |
Chow Seng Guan, Loreto Cantillep |
2002-08-13 |
| 6372553 |
Disposable mold runner gate for substrate based electronic packages |
— |
2002-04-16 |
| 6355199 |
Method of molding flexible circuit with molded stiffener |
Raymundo M. Camenforte |
2002-03-12 |
| 6329606 |
Grid array assembly of circuit boards with singulation grooves |
Bruce J. Freyman, Jack C. Maxcy |
2001-12-11 |
| 6255143 |
Flip chip thermally enhanced ball grid array |
— |
2001-07-03 |
| 6168975 |
Method of forming extended lead package |
Tong Zhang |
2001-01-02 |
| 6103550 |
Molded tape support for a molded circuit package prior to dicing |
Raymundo M. Camenforte |
2000-08-15 |
| 5852870 |
Method of making grid array assembly |
Bruce J. Freyman, Jack C. Maxcy |
1998-12-29 |
| 5635671 |
Mold runner removal from a substrate-based packaged electronic device |
Bruce J. Freyman, Young Wook Heo, Il Kwon Shim |
1997-06-03 |