Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8466545 | Stackable semiconductor package | Akito Yoshida | 2013-06-18 |
| 8227905 | Stackable semiconductor package | Akito Yoshida | 2012-07-24 |
| 7982306 | Stackable semiconductor package | Akito Yoshida | 2011-07-19 |
| 7737542 | Stackable semiconductor package | Akito Yoshida | 2010-06-15 |
| 7459349 | Method of forming a stack of semiconductor packages | Akito Yoshida | 2008-12-02 |
| 6987314 | Stackable semiconductor package with solder on pads on which second semiconductor package is stacked | Akito Yoshida | 2006-01-17 |
| 6946323 | Semiconductor package having one or more die stacked on a prepackaged device and method therefor | — | 2005-09-20 |
| 6879047 | Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor | — | 2005-04-12 |
| 6555917 | Semiconductor package having stacked semiconductor chips and method of making the same | — | 2003-04-29 |
| 6389689 | Method of fabricating semiconductor package | — | 2002-05-21 |
| 6091141 | Bump chip scale semiconductor package | — | 2000-07-18 |
| 6021563 | Marking Bad printed circuit boards for semiconductor packages | Il Kwon Shim | 2000-02-08 |
| 5981873 | Printed circuit board for ball grid array semiconductor package | — | 1999-11-09 |
| 5977624 | Semiconductor package and assembly for fabricating the same | Byung Joon Han | 1999-11-02 |
| 5953589 | Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same | Il Kwon Shim, Robert Francis Darreaux | 1999-09-14 |
| 5915169 | Semiconductor chip scale package and method of producing such | — | 1999-06-22 |
| 5908317 | Method of forming chip bumps of bump chip scale semiconductor package | — | 1999-06-01 |
| 5905633 | Ball grid array semiconductor package using a metal carrier ring as a heat spreader | Kwon Shim | 1999-05-18 |
| 5897334 | Method for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boards | Sun Ho Ha, Byung Joon Han | 1999-04-27 |
| 5864470 | Flexible circuit board for ball grid array semiconductor package | Il Kwon Shim, Robert Francis Darveaux | 1999-01-26 |
| 5858815 | Semiconductor package and method for fabricating the same | Byung Joon Han | 1999-01-12 |
| 5854741 | Unit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the same | Il Kwon Shim | 1998-12-29 |
| 5767446 | Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package | Sun Ho Ha | 1998-06-16 |
| 5729432 | Ball grid array semiconductor package with improved heat dissipation and dehumidification effect | Il Kwon Shim | 1998-03-17 |
| 5708567 | Ball grid array semiconductor package with ring-type heat sink | Il Kwon Shim | 1998-01-13 |