Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165956 | Molded silicon on passive package | Kumar Nagarajan, Flynn Carson, Karthik Shanmugam, Menglu Li, Scott D. Morrison | 2024-12-10 |
| 12087689 | Selectable monolithic or external scalable die-to-die interconnection system methodology | Sanjay Dabral, Jun Zhai, Jung-Cheng Yeh, Kunzhong Hu, Thomas Hoffmann | 2024-09-10 |
| 12074077 | Flexible package architecture concept in fanout | Karthik Shanmugam, Flynn Carson, Jun Zhai, Menglu Li | 2024-08-27 |
| 11862557 | Selectable monolithic or external scalable die-to-die interconnection system methodology | Sanjay Dabral, Jun Zhai, Jung-Cheng Yeh, Kunzhong Hu, Thomas Hoffmann | 2024-01-02 |
| 11728266 | Die stitching and harvesting of arrayed structures | Sanjay Dabral, Jun Zhai, Kunzhong Hu | 2023-08-15 |
| 11395408 | Wafer-level passive array packaging | Scott D. Morrison, Karthik Shanmugam, Rakshit Agrawal, Flynn Carson, Kiranjit Dhaliwal | 2022-07-19 |
| 8815642 | Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies | Jeffrey Alan West, Margaret Simmons-Matthews | 2014-08-26 |
| 8575758 | Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies | Jeffrey Alan West, Margaret Simmons-Matthews | 2013-11-05 |
| 7521284 | System and method for increased stand-off height in stud bumping process | Ariel Lizaba Miranda | 2009-04-21 |
| 6791346 | Testing of BGA and other CSP packages using probing techniques | Rajiv Mehta, Liop-Jin Yap, Chee Keong Tan | 2004-09-14 |
| 6759752 | Single unit automated assembly of flex enhanced ball grid array packages | John Briar | 2004-07-06 |
| 6744125 | Super thin/super thermal ball grid array package | Dioscoro A. Merilo, Seng Guan Chow | 2004-06-01 |
| 6621151 | Lead frame for an integrated circuit chip | Tai Chong Chai, Thiam B. Lim, Yong Chua Teo, James Tan, Eric Neo +1 more | 2003-09-16 |
| 6617525 | Molded stiffener for flexible circuit molding | John Briar | 2003-09-09 |
| 6544812 | Single unit automated assembly of flex enhanced ball grid array packages | John Briar | 2003-04-08 |
| 6537848 | Super thin/super thermal ball grid array package | Dioscoro A. Merilo, Seng Guan Chow | 2003-03-25 |
| 6535004 | Testing of BGA and other CSP packages using probing techniques | Rajiv Mehta, Liop-Jin Yap, Chee Keong Tan | 2003-03-18 |
| 6404212 | Testing of BGA and other CSP packages using probing techniques | Rajiv Mehta, Liop-Jin Yap, Chee Keong Tan | 2002-06-11 |
| 6355199 | Method of molding flexible circuit with molded stiffener | John Briar | 2002-03-12 |
| 6103550 | Molded tape support for a molded circuit package prior to dicing | John Briar | 2000-08-15 |