Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10755993 | Electrical connection structure, semiconductor package and method of forming the same | David Ho, Vempati Srinivasa Rao, Surya Bhattacharya | 2020-08-25 |
| 9506823 | Bonding stress testing arrangement and method of determining stress | Cheryl Sharmani Selvanayagam, Xiaowu Zhang, Alastair David Trigg, Cheng-Kuo Cheng, Xian Tong Chen +1 more | 2016-11-29 |
| 7189594 | Wafer level packages and methods of fabrication | Vaidyanathan Kripesh, Wai Kwan Wong, Mihai Rotaru, Mahadevan Iyer | 2007-03-13 |
| 6621151 | Lead frame for an integrated circuit chip | Thiam B. Lim, Yong Chua Teo, James Tan, Raymundo M. Camenforte, Eric Neo +1 more | 2003-09-16 |
| 6583501 | Lead frame for an integrated circuit chip (integrated circuit peripheral support) | Thiam B. Lim, Yong Chua Teo, James Tan, Ray Camenforte, Eric Neo +1 more | 2003-06-24 |
| 5967577 | Apparatus for dispensing fluid in an array pattern | Sarvotham Bhandarkar, Kishore K. Chakravorty, Jian-Hua Wu | 1999-10-19 |
| 5836520 | Apparatus for dispensing fluid in an array pattern | Sarvotham Bhandarkar, Kishore K. Chakravorty, Jian-Hua Wu | 1998-11-17 |
| 5229329 | Method of manufacturing insulated lead frame for integrated circuits | Boon Q. Seow, Karta W. Tjandra, Thiam B. Lim, Tadashi Saitoh | 1993-07-20 |