Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6621151 | Lead frame for an integrated circuit chip | Tai Chong Chai, Yong Chua Teo, James Tan, Raymundo M. Camenforte, Eric Neo +1 more | 2003-09-16 |
| 6583501 | Lead frame for an integrated circuit chip (integrated circuit peripheral support) | Tai Chong Chai, Yong Chua Teo, James Tan, Ray Camenforte, Eric Neo +1 more | 2003-06-24 |
| 6540866 | Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate | Junfeng Zhang, Cheng Qiang Cui, En-Tang Kang | 2003-04-01 |
| 6537411 | Method for low temperature lamination of metals to polyimides | En-Tang Kang, Arthur Ang, Koon Gee Neoh, Cheng Qiang Cui | 2003-03-25 |
| 6334926 | Method for low temperature lamination of metals to fluoropolymers | En-Tang Kang, Jian Shi, Koon Gee Neoh, Kuang Lee Tan, Cheng Qiang Cui | 2002-01-01 |
| 5925934 | Low cost and highly reliable chip-sized package | — | 1999-07-20 |
| 5893724 | Method for forming a highly reliable and planar ball grid array package | Kishore K. Chakravorty | 1999-04-13 |
| 5892290 | Highly reliable and planar ball grid array package | Kishore K. Chakravorty | 1999-04-06 |
| 5773878 | IC packaging lead frame for reducing chip stress and deformation | Sarvotham Bhandarkar | 1998-06-30 |
| 5434106 | Integrated circuit device and method to prevent cracking during surface mount | Tadashi Saitoh, Boon Q. Seow | 1995-07-18 |
| 5319241 | Lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution | — | 1994-06-07 |
| 5313102 | Integrated circuit device having a polyimide moisture barrier coating | Tadashi Saitoh, Boon Q. Seow | 1994-05-17 |
| 5229329 | Method of manufacturing insulated lead frame for integrated circuits | Tai Chong Chai, Boon Q. Seow, Karta W. Tjandra, Tadashi Saitoh | 1993-07-20 |
| 5227232 | Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution | — | 1993-07-13 |
| 5206536 | Comb insert for semiconductor packaged devices | — | 1993-04-27 |
| 5164815 | Integrated circuit device and method to prevent cracking during surface mount | — | 1992-11-17 |
| 5155578 | Bond wire configuration and injection mold for minimum wire sweep in plastic IC packages | Soon Chye Lian | 1992-10-13 |
| 5146312 | Insulated lead frame for semiconductor packaged devices | — | 1992-09-08 |
| 4745787 | Plug drawing | Dennis H. Sansome | 1988-05-24 |