Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8361837 | Multiple integrated circuit die package with thermal performance | Chee Wah Cheung | 2013-01-29 |
| 7985672 | Solder ball attachment ring and method of use | Poh Leng Eu, Lan Chu Tan | 2011-07-26 |
| 7906844 | Multiple integrated circuit die package with thermal performance | Chee Wah Cheung | 2011-03-15 |
| 7573131 | Die-up integrated circuit package with grounded stiffener | Kai C. Ng, Chee Wah Cheung | 2009-08-11 |
| 6540866 | Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate | Junfeng Zhang, Thiam B. Lim, En-Tang Kang | 2003-04-01 |
| 6537411 | Method for low temperature lamination of metals to polyimides | En-Tang Kang, Arthur Ang, Koon Gee Neoh, Thiam B. Lim | 2003-03-25 |
| 6334926 | Method for low temperature lamination of metals to fluoropolymers | En-Tang Kang, Jian Shi, Koon Gee Neoh, Kuang Lee Tan, Thiam B. Lim | 2002-01-01 |
| 6274650 | Epoxy resin compositions for liquid encapsulation | — | 2001-08-14 |
| 5451526 | Determination of oxidant or reductant concentration by the spectrophotometric or visual response in oxidation or reduction of polyaniline | Yu-Li Huang, Jim Lee | 1995-09-19 |