Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7573131 | Die-up integrated circuit package with grounded stiffener | Cheng Qiang Cui, Chee Wah Cheung | 2009-08-11 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7573131 | Die-up integrated circuit package with grounded stiffener | Cheng Qiang Cui, Chee Wah Cheung | 2009-08-11 |