CC

Chee Wah Cheung

TP Technology Partners: 20 patents #1 of 201Top 1%
AD Analog Devices: 2 patents #738 of 1,943Top 40%
Overall (All Time): #188,770 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12249704 Method of direct embedding a lithium ion battery on a flexible printed circuit board Kelvin Po Leung Pun, Jason Rotanson, Wing Lung Hon, Yam Chong, Wai Yin Wong +2 more 2025-03-11
11764392 Battery assembly and method of manufacturing the same Kelvin Po Leung Pun, Vikram Venkatadri, David Bolognia 2023-09-19
11749595 Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Kelvin Po Leung Pun 2023-09-05
11594509 Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Kelvin Po Leung Pun 2023-02-28
11553598 Integrated electro-optical flexible circuit board Kelvin Po Leung Pun, Jason Rotanson 2023-01-10
11295891 Electric coil structure Vikram Venkatadri, David Bolognia, Kelvin Po Leung Pun 2022-04-05
11076491 Integrated electro-optical flexible circuit board Kelvin Po Leung Pun, Jason Rotanson 2021-07-27
11069606 Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Kelvin Po Leung Pun 2021-07-20
10923449 Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Kelvin Po Leung Pun 2021-02-16
10917973 Method of direct embedding a lithium ion battery on a flexible printed circuit board Kelvin Po Leung Pun, Jason Rotanson, Wing Lung Hon, Yam Chong, Wai Yin Wong +2 more 2021-02-09
10643942 Formation of fine pitch traces using ultra-thin PAA modified fully additive process Kelvin Po Leung Pun 2020-05-05
10636734 Formation of fine pitch traces using ultra-thin PAA modified fully additive process Kelvin Po Leung Pun 2020-04-28
10510653 Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Kelvin Po Leung Pun 2019-12-17
10468342 Formation of fine pitch traces using ultra-thin PAA modified fully additive process Kelvin Po Leung Pun 2019-11-05
10362680 Patterning of graphene circuits on flexible substrates Kelvin Po Leung Pun 2019-07-23
10103095 Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Kelvin Po Leung Pun 2018-10-16
9974188 Patterning of graphene circuits on flexible substrates Kelvin Po Leung Pun 2018-05-15
9637376 Gyro MEMS sensor package Kelvin Po Leung Pun 2017-05-02
9360318 Gyro MEMS sensor package Kelvin Po Leung Pun 2016-06-07
8361837 Multiple integrated circuit die package with thermal performance Cheng Qiang Cui 2013-01-29
7906844 Multiple integrated circuit die package with thermal performance Cheng Qiang Cui 2011-03-15
7573131 Die-up integrated circuit package with grounded stiffener Cheng Qiang Cui, Kai C. Ng 2009-08-11