Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249704 | Method of direct embedding a lithium ion battery on a flexible printed circuit board | Chee Wah Cheung, Jason Rotanson, Wing Lung Hon, Yam Chong, Wai Yin Wong +2 more | 2025-03-11 |
| 11764392 | Battery assembly and method of manufacturing the same | Vikram Venkatadri, David Bolognia, Chee Wah Cheung | 2023-09-19 |
| 11749595 | Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect | Chee Wah Cheung | 2023-09-05 |
| 11594509 | Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect | Chee Wah Cheung | 2023-02-28 |
| 11553598 | Integrated electro-optical flexible circuit board | Chee Wah Cheung, Jason Rotanson | 2023-01-10 |
| 11295891 | Electric coil structure | Vikram Venkatadri, David Bolognia, Chee Wah Cheung | 2022-04-05 |
| 11076491 | Integrated electro-optical flexible circuit board | Chee Wah Cheung, Jason Rotanson | 2021-07-27 |
| 11069606 | Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect | Chee Wah Cheung | 2021-07-20 |
| 10923449 | Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect | Chee Wah Cheung | 2021-02-16 |
| 10917973 | Method of direct embedding a lithium ion battery on a flexible printed circuit board | Chee Wah Cheung, Jason Rotanson, Wing Lung Hon, Yam Chong, Wai Yin Wong +2 more | 2021-02-09 |
| 10643942 | Formation of fine pitch traces using ultra-thin PAA modified fully additive process | Chee Wah Cheung | 2020-05-05 |
| 10636734 | Formation of fine pitch traces using ultra-thin PAA modified fully additive process | Chee Wah Cheung | 2020-04-28 |
| 10510653 | Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect | Chee Wah Cheung | 2019-12-17 |
| 10468342 | Formation of fine pitch traces using ultra-thin PAA modified fully additive process | Chee Wah Cheung | 2019-11-05 |
| 10362680 | Patterning of graphene circuits on flexible substrates | Chee Wah Cheung | 2019-07-23 |
| 10103095 | Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect | Chee Wah Cheung | 2018-10-16 |
| 9974188 | Patterning of graphene circuits on flexible substrates | Chee Wah Cheung | 2018-05-15 |
| 9637376 | Gyro MEMS sensor package | Chee Wah Cheung | 2017-05-02 |
| 9360318 | Gyro MEMS sensor package | Chee Wah Cheung | 2016-06-07 |