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Method of cobalt silicidation using an oxide-Titanium interlayer |
Chung Woh Lai, Beichao Zhang, Eng Hua Lim, Hai Jiang Peng, Charles Lin |
2003-11-25 |
| 6537411 |
Method for low temperature lamination of metals to polyimides |
En-Tang Kang, Koon Gee Neoh, Cheng Qiang Cui, Thiam B. Lim |
2003-03-25 |
| 6528886 |
Intermetal dielectric layer for integrated circuits |
Huang Liu, John Sudijono, Juan Boon Tan, Edwin Goh, Alan Cuthbertson +3 more |
2003-03-04 |
| 6451687 |
Intermetal dielectric layer for integrated circuits |
Huang Liu, John Sudijono, Juan Boon Tan, Edwin Goh, Alan Cuthbertson +3 more |
2002-09-17 |
| 6383922 |
Thermal stability improvement of CoSi2 film by stuffing in titanium |
Bei Chao Zhang, Chung Woh Lai, Eng Hua Lim, Mei Sheng Zhou, Peter Chew |
2002-05-07 |
| 6232217 |
Post treatment of via opening by N-containing plasma or H-containing plasma for elimination of fluorine species in the FSG near the surfaces of the via opening |
Xu Yi |
2001-05-15 |