Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11980548 | Carbon fiber composite artificial bone and preparation method thereof | Zhoujian Tan, Jiqiao Liao, Xiang Zhang | 2024-05-14 |
| 11597082 | Dispatching method and device, and non-transitory readable storage medium | — | 2023-03-07 |
| 10510932 | Optoelectronic modules including optoelectronic device subassemblies and methods of manufacturing the same | Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Eunice Ho Hui Ong +6 more | 2019-12-17 |
| 10269645 | Fin field-effect transistor and fabrication method thereof | — | 2019-04-23 |
| 10243111 | Optoelectronic device subassemblies and methods of manufacturing the same | Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Eunice Ho Hui Ong +6 more | 2019-03-26 |
| 10199426 | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules | Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger +7 more | 2019-02-05 |
| 10186540 | Optoelectronic modules that have shielding to reduce light leakage or stray light | Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger +5 more | 2019-01-22 |
| 9859327 | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules | Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger +7 more | 2018-01-02 |
| 9543354 | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules | Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger +7 more | 2017-01-10 |
| 9094593 | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules | Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger +5 more | 2015-07-28 |
| 7060613 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2006-06-13 |
| 6813796 | Apparatus and methods to clean copper contamination on wafer edge | Sudipto Ranendra Roy, Subhash Gupta, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou +2 more | 2004-11-09 |
| 6730591 | Method of using silicon rich carbide as a barrier material for fluorinated materials | Licheng M. Han, Simon Chooi, Mei Sheng Zhou, Joseph Xie | 2004-05-04 |
| 6540841 | Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate | Sudipto Ranendra Roy, Subhash Gupta, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou +2 more | 2003-04-01 |
| 6429129 | Method of using silicon rich carbide as a barrier material for fluorinated materials | Licheng M. Han, Simon Chooi, Mei Sheng Zhou, Joseph Xie | 2002-08-06 |
| 6424044 | Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization | Licheng M. Han, Joseph Xie, Mei Sheng Zhou, Simon Chooi | 2002-07-23 |
| 6375857 | Method to form fuse using polymeric films | Chit Hwei Ng, Sanford Chu | 2002-04-23 |
| 6365508 | Process without post-etch cleaning-converting polymer and by-products into an inert layer | Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy, Paul Ho +2 more | 2002-04-02 |
| 6358821 | Method of copper transport prevention by a sputtered gettering layer on backside of wafer | Subhash Gupta, Simon Chooi, Sudipto Ranendra Roy, Paul Ho, Yakub Aliyu +2 more | 2002-03-19 |
| 6340608 | Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2002-01-22 |
| 6261942 | Dual metal-oxide layer as air bridge | Mei Sheng Zhou, Simon Chooi | 2001-07-17 |
| 6232217 | Post treatment of via opening by N-containing plasma or H-containing plasma for elimination of fluorine species in the FSG near the surfaces of the via opening | Arthur Ang | 2001-05-15 |