Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7452808 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2008-11-18 |
| 7060613 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2006-06-13 |
| 6987321 | Copper diffusion deterrent interface | Simon Chooi, Mei Sheng Zhou, John Sudijono, Subbash Gupta, Sudipto Ranendra Roy +2 more | 2006-01-17 |
| 6967162 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2005-11-22 |
| 6821888 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Meisheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy | 2004-11-23 |
| 6813796 | Apparatus and methods to clean copper contamination on wafer edge | Sudipto Ranendra Roy, Subhash Gupta, Simon Chooi, Xu Yi, Mei Sheng Zhou +2 more | 2004-11-09 |
| 6803305 | Method for forming a via in a damascene process | Daniel Yen, Wei Cheng, Ding Yi | 2004-10-12 |
| 6720204 | Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding | John Sudijono, Mei Sheng Zhou, Simon Chooi, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2004-04-13 |
| 6705512 | Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Mei Sheng Zhou, John Sudijono +2 more | 2004-03-16 |
| 6692579 | Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequence | Sudipto Ranendra Roy, Yi Xu, Simon Chooi, Mei Sheng Zhou, John Sudijono +2 more | 2004-02-17 |
| 6686279 | Method for reducing gouging during via formation | Daniel Yen, Wei Cheng, Lee Yuan Ping | 2004-02-03 |
| 6683002 | Method to create a copper diffusion deterrent interface | Simon Chooi, Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2004-01-27 |
| 6540841 | Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate | Sudipto Ranendra Roy, Subhash Gupta, Simon Chooi, Xu Yi, Mei Sheng Zhou +2 more | 2003-04-01 |
| 6475810 | Method of manufacturing embedded organic stop layer for dual damascene patterning | Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy, Paul Ho +2 more | 2002-11-05 |
| 6429117 | Method to create copper traps by modifying treatment on the dielectrics surface | John Sudijono, Mei Sheng Zhou, Simon Chooi, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2002-08-06 |
| 6415973 | Method of application of copper solution in flip-chip, COB, and micrometal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Mei Sheng Zhou, John Sudijono +2 more | 2002-07-09 |
| 6417088 | Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Yi Xu, Simon Chooi, Mei Sheng Zhou, John Sudijono +2 more | 2002-07-09 |
| 6391783 | Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique | John Sudijono, Mei Sheng Zhou, Simon Chooi, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2002-05-21 |
| 6378759 | Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Mei Sheng Zhou, John Sudijono +2 more | 2002-04-30 |
| 6365508 | Process without post-etch cleaning-converting polymer and by-products into an inert layer | Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy, Paul Ho +2 more | 2002-04-02 |
| 6358821 | Method of copper transport prevention by a sputtered gettering layer on backside of wafer | Subhash Gupta, Simon Chooi, Sudipto Ranendra Roy, Paul Ho, Xu Yi +2 more | 2002-03-19 |
| 6350689 | Method to remove copper contamination by using downstream oxygen and chelating agent plasma | Paul Ho, Simon Chooi, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2002-02-26 |
| 6340608 | Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads | Simon Chooi, Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2002-01-22 |
| 6309982 | Method for minimizing copper diffusion by doping an inorganic dielectric layer with a reducing agent | Simon Chooi, Yi Xu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2001-10-30 |
| 6277691 | Method to fabricate a robust and reliable memory device | Ngo Dinh Quoc | 2001-08-21 |