Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290432 | Method for forming perovskite solar cell with printable carbon electrode | Qian Li, Chao Cai, Qingdan Yang, Jia Li | 2019-05-14 |
| 9583711 | Conductive and photosensitive polymers | Wing Leung Wong | 2017-02-28 |
| 9243340 | Non-vacuum method of manufacturing light-absorbing materials for solar cell application | Kam Piu Ho, Man Wah Liu, Ranshi Wang, Wai Chun Luk, Wing Ho Choi +4 more | 2016-01-26 |
| 7452808 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2008-11-18 |
| 7060613 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2006-06-13 |
| 6987321 | Copper diffusion deterrent interface | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subbash Gupta +2 more | 2006-01-17 |
| 6967162 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2005-11-22 |
| 6813796 | Apparatus and methods to clean copper contamination on wafer edge | Sudipto Ranendra Roy, Subhash Gupta, Simon Chooi, Xu Yi, Yakub Aliyu +2 more | 2004-11-09 |
| 6720204 | Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta +2 more | 2004-04-13 |
| 6692579 | Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequence | Sudipto Ranendra Roy, Yi Xu, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou +2 more | 2004-02-17 |
| 6683002 | Method to create a copper diffusion deterrent interface | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2004-01-27 |
| 6565664 | Method for stripping copper in damascene interconnects | Subhash Gupta, Simon Chooi, Mei Sheng Zhou | 2003-05-20 |
| 6548413 | Method to reduce microloading in metal etching | Thomas Schulue, Raymond Joy, Wai Lok Lee, Ramasamy Chockalingam, Ba Tuan Pham +1 more | 2003-04-15 |
| 6540841 | Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate | Sudipto Ranendra Roy, Subhash Gupta, Simon Chooi, Xu Yi, Yakub Aliyu +2 more | 2003-04-01 |
| 6475810 | Method of manufacturing embedded organic stop layer for dual damascene patterning | Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy, Yi Xu +2 more | 2002-11-05 |
| 6429117 | Method to create copper traps by modifying treatment on the dielectrics surface | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta +2 more | 2002-08-06 |
| 6394114 | Method for stripping copper in damascene interconnects | Subhash Gupta, Simon Chooi, Mei Sheng Zhou | 2002-05-28 |
| 6391783 | Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta +2 more | 2002-05-21 |
| 6368958 | Method to deposit a cooper seed layer for dual damascence interconnects | Subhash Gupta, Mei Sheng Zhou, Simon Chooi | 2002-04-09 |
| 6365508 | Process without post-etch cleaning-converting polymer and by-products into an inert layer | Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy, Xu Yi +2 more | 2002-04-02 |
| 6358821 | Method of copper transport prevention by a sputtered gettering layer on backside of wafer | Subhash Gupta, Simon Chooi, Sudipto Ranendra Roy, Xu Yi, Yakub Aliyu +2 more | 2002-03-19 |
| 6350689 | Method to remove copper contamination by using downstream oxygen and chelating agent plasma | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2002-02-26 |
| 6340608 | Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2002-01-22 |
| 6309982 | Method for minimizing copper diffusion by doping an inorganic dielectric layer with a reducing agent | Simon Chooi, Yi Xu, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2001-10-30 |
| 6274499 | Method to avoid copper contamination during copper etching and CMP | Subhash Gupta, Mei Sheng Zhou, Ramasamy Chockalingam | 2001-08-14 |