Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11696509 | Flexible electric generator for generating electric power | Han Wang, Qingyi YANG, Jianjun Song, Jifan LI | 2023-07-04 |
| 11472926 | Impact protection material and method of making the same | Jianjun Song, Han Wang, Kang Zhang, Liang Zhang, Cheng-Yu Chen +1 more | 2022-10-18 |
| 10572089 | Sensing film with an integrated structure | Chung Pui Chan, Wing Hong CHOI, Lai Fan Lai, Chien Chung | 2020-02-25 |
| 10385250 | Thermally conductive composites and method of preparing same | Haojun Zhu, Changbao Ren, Lai To Leung | 2019-08-20 |
| 10329660 | Flexible transparent thin film | Chung Pui Chan, Lai Fan Lai, Wing Hong CHOI, Bin Zhang, Chien Chung +1 more | 2019-06-25 |
| 10127342 | Method of designing and modifying lithium ion battery cathode materials | Jianzhuo Xin, Wing Yu Chau, Yingkai Jiang, Yeming Xu | 2018-11-13 |
| 10103282 | Direct texture transparent conductive oxide served as electrode or intermediate layer for photovoltaic and display applications | Chung Pui Chan, Wing Hong CHOI | 2018-10-16 |
| 9666906 | High voltage electrolyte and lithium ion battery | Kam Piu Ho, Ranshi Wang, Yeming Xu, Wai Chun Luk, Mei Mei Hsu | 2017-05-30 |
| 9637384 | Fullerene derivatives and their applications in organic photovoltaics | Wing Leung Wong, Lai To Leung, Liang Zhang, Chi Mei Chow, Haojun Zhu +1 more | 2017-05-02 |
| 9371979 | Method and hardware to enhance light out-coupling | Tsang Ming Michael CHOI, Yuen Yan Gena Tsang | 2016-06-21 |
| 6877517 | Plasma etch method for forming plasma etched silicon layer | Xue Chun Dai | 2005-04-12 |
| 6790374 | Plasma etch method for forming plasma etched silicon layer | Xuechun Dai | 2004-09-14 |
| 6705512 | Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding | Simon Chooi, Yi Xu, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2004-03-16 |
| 6415973 | Method of application of copper solution in flip-chip, COB, and micrometal bonding | Simon Chooi, Yi Xu, Mei Sheng Zhou, Yakub Aliyu, John Sudijono +2 more | 2002-07-09 |
| 6417088 | Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding | Yi Xu, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2002-07-09 |
| 6387859 | Method and cleaner composition for stripping copper containing residue layers | — | 2002-05-14 |
| 6378759 | Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding | Simon Chooi, Yi Xu, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2002-04-30 |
| 6123088 | Method and cleaner composition for stripping copper containing residue layers | — | 2000-09-26 |
| 6114243 | Method to avoid copper contamination on the sidewall of a via or a dual damascene structure | Subhash Gupta, Mei Sheng Zhou, Simon Yew-Meng Chool | 2000-09-05 |