Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6790374 | Plasma etch method for forming plasma etched silicon layer | Kwok Keung Paul Ho | 2004-09-14 |
| 5888887 | Trenchless buried contact process technology | Xudong Li, Guangping Hua, Kei Tee Tiew | 1999-03-30 |