SH

Stephan Heimgartner

HP Heptagon Micro Optics Pte.: 17 patents #4 of 81Top 5%
AP Ams Sensors Singapore Pte.: 5 patents #28 of 134Top 25%
HO Heptagon Oy: 2 patents #3 of 6Top 50%
📍 Aarau, CH: #3 of 161 inventorsTop 2%
Overall (All Time): #173,134 of 4,157,543Top 5%
24
Patents All Time

Issued Patents All Time

Showing 1–24 of 24 patents

Patent #TitleCo-InventorsDate
10741613 Optical element stack assemblies Alexander Bietsch, Peter Riel 2020-08-11
10444477 Wafer-level fabrication of optical devices with front focal length correction Hartmut Rudmann, Matthias Maluck, Alexander Bietsch, Peter Roentgen 2019-10-15
10437005 Techniques for reducing distortion of optical beam shaping elements Markus Rossi 2019-10-08
10373996 Optical modules including focal length adjustment and fabrication of the optical modules Ville Kettunen, Nicola Spring, Alexander Bietsch, Mario Cesana, Hartmut Rudmann +2 more 2019-08-06
10236314 Optical devices and opto-electronic modules and methods for manufacturing the same Markus Rossi, Hartmut Rudmann, Alexander Bietsch, Robert Lenart 2019-03-19
10199426 Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Jens Geiger, Sonja Hanselmann +7 more 2019-02-05
10186540 Optoelectronic modules that have shielding to reduce light leakage or stray light Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Jens Geiger, Xu Yi +5 more 2019-01-22
10101555 Camera module including a non-circular lens Jukka Alasirniö, Hartmut Rudmann, Mario Cesana 2018-10-16
10096644 Optical devices, in particular computational cameras, and methods for manufacturing the same Alexander Bietsch, Hartmut Rudmann, Markus Rossi, Simon Gubser 2018-10-09
9977153 Stacks of arrays of beam shaping elements including stacking, self-alignment and/or self-centering features Hartmut Rudmann, Markus Rossi, Mario Cesana, Ohad Meitav, Peter Roentgen +2 more 2018-05-22
9899251 Use of vacuum chucks to hold a wafer or wafer sub-stack Hartmut Rudmann, John A. Vidallon 2018-02-20
9859327 Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Jens Geiger, Sonja Hanselmann +7 more 2018-01-02
9826131 Compact camera module arrangements that facilitate dam-and-fill and similar encapsulation techniques Jukka Alasirniö 2017-11-21
9793152 Use of vacuum chucks to hold a wafer or wafer sub-stack Hartmut Rudmann, John A. Vidallon 2017-10-17
9748297 Optical modules including focal length adjustment and fabrication of the optical modules Ville Kettunen, Nicola Spring, Alexander Bietsch, Mario Cesana, Hartmut Rudmann +2 more 2017-08-29
9634051 Optical devices, in particular computational cameras, and methods for manufacturing the same Alexander Bietsch, Hartmut Rudmann, Markus Rossi, Simon Gubser 2017-04-25
9595553 Optical modules including focal length adjustment and fabrication of the optical modules Ville Kettunen, Nicola Spring, Alexander Bietsch, Mario Cesana, Hartmut Rudmann +2 more 2017-03-14
9543354 Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Jens Geiger, Sonja Hanselmann +7 more 2017-01-10
9490287 Optical devices and opto-electronic modules and methods for manufacturing the same Markus Rossi, Hartmut Rudmann, Alexander Bietsch, Robert Lenart 2016-11-08
9485397 Camera, and method of manufacturing a plurality of cameras Hartmut Rudmann 2016-11-01
9094593 Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Jens Geiger, Xu Yi +5 more 2015-07-28
8962079 Manufacturing optical elements Hartmut Rudmann, Susanne Westenhöfer, Diane Morgan, Markus Rossi 2015-02-24
7704418 Manufacturing optical elements Harmut Rudmann, Susanne Westenhöfer, Markus Rossi 2010-04-27
7692256 Method of producing a wafer scale package Hartmut Rudmann, Markus Rossi 2010-04-06