Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7670946 | Methods to eliminate contact plug sidewall slit | Yong Kong Siew | 2010-03-02 |
| 7601607 | Protruded contact and insertion of inter-layer-dielectric material to match damascene hardmask to improve undercut for low-k interconnects | Wuping Liu, Raymond Joy, Liang-Choo Hsia, Boon Meng Seah, Shyam Sundar Pal | 2009-10-13 |
| 7323408 | Metal barrier cap fabrication by polymer lift-off | Wuping Liu, Liang-Choo Hsia | 2008-01-29 |
| 7153766 | Metal barrier cap fabrication by polymer lift-off | Wuping Liu, Liang-Choo Hsia | 2006-12-26 |
| 7045455 | Via electromigration improvement by changing the via bottom geometric profile | Chun Hui Low, Hong Lim Lee, Sang Yee Loong, Qiang Guo | 2006-05-16 |
| 6653227 | Method of cobalt silicidation using an oxide-Titanium interlayer | Chung Woh Lai, Eng Hua Lim, Arthur Ang, Hai Jiang Peng, Charles Lin | 2003-11-25 |