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Method of fabricating semiconductor devices including PMOS devices having embedded SiGe |
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Methods for fabricating integrated circuits having device contacts |
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Integrated circuit system employing low-k dielectrics and method of manufacture thereof |
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Integrated circuit hard mask processing system |
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Method of controlled low-k via etch for Cu interconnections |
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Structure and method to prevent charge damage from e-beam curing process |
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Integrated circuit manufacturing method using hard mask |
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Protruded contact and insertion of inter-layer-dielectric material to match damascene hardmask to improve undercut for low-k interconnects |
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Method to fabricate aligned dual damascene openings |
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Metal barrier cap fabrication by polymer lift-off |
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Method of fabrication of a die oxide ring |
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Self-patterning of photo-active dielectric materials for interconnect isolation |
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Metal barrier cap fabrication by polymer lift-off |
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Self-patterning of photo-active dielectric materials for interconnect isolation |
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Integrated circuit with simultaneous fabrication of dual damascene via and trench |
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Method to fabricate aligned dual damascene openings |
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