Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281278 | Interconnects with improved TDDB | Wu Ping Liu, Lawrence A. Clevenger | 2016-03-08 |
| 8619540 | Apparatus and method for transmitting and receiving uplink sounding signal in broadband wireless communication system | Soon-Young Yoon, Keun-Chul Hwang, In-Seok Hwang, June Moon | 2013-12-31 |
| 8358007 | Integrated circuit system employing low-k dielectrics and method of manufacture thereof | Dong Kyun Sohn, Wuping Liu, Fan Zhang, Juan Boon Tan, Bei Chao Zhang +3 more | 2013-01-22 |
| 8053361 | Interconnects with improved TDDB | Wu Ping Liu, Lawrence A. Clevenger | 2011-11-08 |
| 7906426 | Method of controlled low-k via etch for Cu interconnections | Wuping Liu, Johnny Widodo, Teck Jung Tang, Han Wah Ng, Larry Clevenger +1 more | 2011-03-15 |
| 7687381 | Method of forming electrical interconnects within insulating layers that form consecutive sidewalls including forming a reaction layer on the inner sidewall | Jae Hak Kim, Wu Ping Liu, Johnny Widodo | 2010-03-30 |