Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10457001 | Method for forming a matrix composite layer and workpiece with a matrix composite layer | Jayaganasan Narayanasamy, Jagen Krishnan, Sanjay Kumar Murugan | 2019-10-29 |
| 7781895 | Via electromigration improvement by changing the via bottom geometric profile | Bei Chao Zhang, Chun Hui Low, Sang Yee Loong, Qiang Guo | 2010-08-24 |
| 7691739 | Via electromigration improvement by changing the via bottom geometric profile | Bei Chao Zhang, Chun Hui Low, Sang Yee Loong, Qiang Guo | 2010-04-06 |
| 7045455 | Via electromigration improvement by changing the via bottom geometric profile | Beichao Zhang, Chun Hui Low, Sang Yee Loong, Qiang Guo | 2006-05-16 |
| 6765296 | Via-sea layout integrated circuits | Jae Soo Park, Chivukula Subramanyam, Thow Phock Chua | 2004-07-20 |