Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10651109 | Selective plating of semiconductor package leads | Syahir Abd Hamid, Mian Mian Lam, Jayaganasan Narayanasamy, Fabian Schnoy, Thomas Stoek +1 more | 2020-05-12 |
| 10457001 | Method for forming a matrix composite layer and workpiece with a matrix composite layer | Jayaganasan Narayanasamy, Sanjay Kumar Murugan, Hong Lim Lee | 2019-10-29 |
| 10096508 | Assembly for handling a semiconductor die and method of handling a semiconductor die | Ronald Paramio Joves, Thanabal Ganesh Kunamani, Kuang Ming Lee, Avelino Oliveros Sumagpoa, Kian Heong Tan +2 more | 2018-10-09 |
| 9852918 | Embedding additive particles in encapsulant of electronic device | Peh Hean Teh, Swee Kah Lee, Poh Cheng Lim, Joachim Mahler, Chew Theng Tai +2 more | 2017-12-26 |
| 9540539 | Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device | Swee Kah Lee, Joachim Mahler, Chew Theng Tai, Yik Yee Tan, Soon Lock Goh +2 more | 2017-01-10 |